SIgnal And Power integrity Engineer

Description

Senior Engineer, Signal Integrity and Power Integrity, – Milpitas, CA

Socionext Inc. (SNI) is an innovative enterprise that designs, develops and delivers System-on-Chip solutions to customers worldwide. The company focuses on AR/VR, ADAS, imaging, networking, data storage and other dynamic technologies that drive today’s leading-edge applications. Socionext combines world-class expertise, experience, and an extensive IP portfolio to provide exceptional solutions and ensure a better quality of experience for customers. Founded in 2015, Socionext Inc.

is headquartered in Yokohama, and has offices in Japan, Asia, United States and Europe to lead its product development and sales activities. Socionext America Inc. (SNA), a wholly owned subsidiary of SNI.

We are seeking a Senior Signal Integrity/Power Integrity, Engineer to work from our Milpitas, CA. office.

The Signal Integrity/Power Integrity Engineering function provides support, expertise, and insight to the Silicon device development team through preliminary activities of package selection, routing techniques and necessary simulation work. The position involves diverse responsibilities, including evaluation of new packaging technology, package recommendation for custom devices, substrate design support, device/package qualification. You will be working very closely with Package Design/Manufacturing team in our headquarter and customers in USA.

Also, you will be working very closely with Engineering teams located in our Bangalore, INDIA and Santa Clara, CA offices during pre/post sales process.

This Senior position requires experience in the Fabless semiconductor model with a broad knowledge of package technology and manufacturing. Successful candidates will have a deep understanding of a variety of IC package technologies. Candidate should possess specific experience in the following areas: high performance build-up substrates, flip chip assembly or 2.5D packaging and knowledge of Chiplet technology, Optical integrated packages and also experience in extracting/simulating package designs for SI and PI using tools such as HFSS, POWER SI and other leading tools.

• Bachelor’s degree in electrical engineering, or other semiconductor packaging related discipline

• 8
  -10 years of experience in semiconductor packaging design and simulations
• Record of success in cross-functional team environment
• Good experience with SI/PI tools for package level extraction/simulation
• Ability to work with Package Layout engineers.
• Strong presentation and communication skills

• Good knowledge of IC package materials and manufacturing
• Base Pay + Bonus(es)

Socionext America is an equal opportunity employer. We do not discriminate on the basis of sex (including all gender identities and expressions), race, or ethnicity.

• 401(k)
• 401(k) matching
• Employee assistance program
• Flexible spending account
• Health insurance
• Health savings account
• Life insurance
• Paid time off
• Referral program
• Vision insurance

Work Location:

Hybrid remote in Milpitas, CA 95035