Senior Process Engineer

Senior Process Engineer Integra Technologies Silicon Valley, LLC
• Milpitas, CA, United States

POSITION SUMMARY (Briefly describe the purpose of the position)

The Senior Process Engineer will perform IC Assembly process development and improvement, directly resulting in increased efficiency and quality on the production floor. This will be achieved through process documentation, operator training, and design of experiments.

KEY RESPONSIBILITIES /ESSENTIAL FUNCTIONS INCLUDE (List in order of importance)

• Assembly Engineering support for the Customer and Sales Group to review Customer requirements, and determine the correct process and materials to meet those requirements.

• Daily interaction directly with customers with regard to technical issues and specification reviews.

• Manage and define Assembly Processes relating to specific Products and/or Customers.

• Responsible for conducting thorough Design of Experiments on new IC Assembly Processes with the goal of developing processes and enhancing productivity.

• Provide DOE, SPC, and yield reporting in a clear and presentable format.

• Collect Assembly yield data and perform yield analysis for production equipment and customer products.

• Generate detailed reports and specifications documenting all experimental and process findings and procedures.

• Assess existing processes and identify areas of improvement and solutions for these systems.

• Evaluate and provide recommendations on new equipment that will enhance the current production capabilities.

• Conduct root cause analysis and corrective actions related to process failures.

• Identify and implement cost, quality, and yield improvements.

• Flexible to perform other duties as assigned.

JOB REQUIREMENTS INCLUDE (List as required or preferred)

Education:

Bachelor's Degree in Engineering, Electrical, Mechanical, Material Science, or related field preferred.

Experience:

• Advanced understanding of Semiconductor processes.

• Hands‑on Experience in Semiconductor Back End Process Engineering required.

• Hands‑on Experience in wafer thinning, dicing, die‑attach, flip chip, and wire bonding preferred.

Knowledge/

Skills:

• 10 years of Assembly Process Engineering experience, preferred Hands on in Die Attach, Wire Bond or Mold.

• Knowledge of basic AutoCAD or Solidworks preferred.

• Statistical Process Control, Design of Experiments & FMEA experience are all highly desirable.

• Detail‑oriented, data entry accuracy, problem solver, good analytical skills, team player, multitask capability.

• General computer skills, including Microsoft Office Suite.

• Strong written and verbal communication skills.

Citizenship:
Must be a United States Citizen in order to work on sensitive military and aerospace programs.

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