Senior Packaging Engineer

Be visionary

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality, environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging, and pharmaceutical research.

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Location: Milpitas CA or Garland TX (On-site)

As a Senior Packaging Engineer at Teledyne HiRel Electronics you’ll play a critical role in shaping the future of aerospace and defense electronics. You will lead packaging design initiatives ensuring our products meet stringent reliability standards while driving innovation in integrated circuit packaging. Your expertise will help us deliver cutting‑edge solutions to meet customer demands and industry trends.

• Lead the design and development of new integrated circuit packages (plastic ceramic hybrid).
• Translate customer requirements into optimized packaging solutions.
• Collaborate with production and marketing teams to ensure feasibility and cost‑effectiveness.
• Assess and negotiate design trade‑offs with customers and internal teams.
• Research technology trends and recommend improvements for high‑reliability applications.
• Review and generate mechanical drawings for custom and standard packages.
• Interface with customers and suppliers to represent Teledyne with authority and expertise.
• Maintain knowledge of MIL‑STD 883 and 1835 standards and apply them to designs.

• Strong knowledge of semiconductor electronics and IC packaging required
  .
• Masters degree in engineering or equivalent experience (8 years)
  required
  .
• Experience in aerospace and defense segment preferred
  .
• Familiarity with packaging materials and high‑reliability applications required
  .
• MIL‑STD 883 and 1835 experience preferred
  .
• Ability to work independently and on‑site required
  .
• US citizenship and valid passport required
  .
• Ability to travel up to 10% domestically and internationally required
  .

• Opportunity to work on advanced aerospace and defense technologies.
• Collaborative team environment with strong technical leadership.
• Competitive compensation and benefits package.

Apply today to join a team committed to innovation and excellence. After submitting your application our recruitment team will review your profile and contact you via email or phone for next steps.

US citizenship and ability to obtain DoD security clearance may be required.

$ - $

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including but not limited to location, education/training, work experience, key skills and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age or any other characteristic or non‑merit based factor made unlawful by federal, state or local laws.

Required Experience: Senior IC

• Continuous Integration
• Food Industry
• Minitab
• Packaging
• CAD
• Mechanical Knowledge
• Plastics Blow Molding
• Solid Works
• Mechanical Engineering
• Plastics Injection Molding
• Microsoft Project
• Manufacturing

Employment Type: Full-Time

Experience: years

Vacancy: 1

Monthly Salary Salary: 113600 - 151400