Engineer - Materials

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi‑billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally‑recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values‑based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values;

we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Visit our careers page to see what exciting opportunities and company perks await!

We are seeking a motivated Manufacturing Engineer I with a strong background in Materials Science or Materials Engineering who enjoys working in a collaborative team environment. This is an entry‑level opportunity ideal for recent college BS graduates.

In this role, you will support engineering efforts related to semiconductor devices and manufacturing assembly, with a primary focus on material analysis, characterization, and process–material interactions. The position is hands‑on and centered on chip and wire assembly processes, while also providing strong exposure to process development, production data analysis, and continuous improvement initiatives.

• Support manufacturing and process development activities for semiconductor chip and wire assemblies, with emphasis on materials performance and reliability.
• Evaluate and characterize materials used in semiconductor assembly, including solders, brazes, epoxies, and encapsulation compounds.
• Partner with Operations and Engineering teams to troubleshoot manufacturing issues related to material defects, adhesion, thermal performance, and mechanical integrity.
• Participate in root cause investigations with focus on material‑related failures such as delamination, corrosion, cracking, or contamination.
• Collect, analyze, and interpret production and material test data to identify opportunities for yield improvement and defect reduction.
• Support continuous improvement initiatives using statistical tools and structured problem‑solving methods.
• Create and revise process documentation, work instructions, and training materials related to materials handling and processing.
• Learn and apply industry standards relevant to semiconductor assembly and materials reliability.

• Bachelor’s degree in Materials Science, Materials Engineering, Mechanical Engineering, or a related engineering discipline.
• 0–2.5 years of experience preferred in manufacturing, materials, or semiconductor environments. Will consider candidates with no experience but having relevant internship, co‑op, research, or project experience.
• Academic or practical experience with:
  • Material characterization techniques (e.g., microscopy, hardness testing, thermal analysis, or spectroscopy).
  • Failure analysis or reliability testing.
• Exposure to statistical methods such as SPC, Gage R&R, DOE, 5‑Why’s, or Lean/6‑Sigma concepts (academic or internship experience acceptable).
• Strong organizational skills with the ability to manage multiple assignments.
• Effective verbal and written communication skills with the ability to work cross‑functionally.

• Exposure to semiconductor assembly processes such as die attach and wire bonding.
• Familiarity with…