Packaging Design Engineer

Packaging Design Engineer – IC Resources

My client is looking for a Package Design Engineer to be based in Switzerland. This is for a cutting‑edge, semiconductor company, ideal for someone wishing to join a high‑tech scale‑up.

• Complete and review the package design requirements in line with project quotas and design rules
• Validate the electrical characteristics of the Package
• Implement specific cost‑saving techniques in client Package designs
• Communicate and collaborate with teams cross‑functionally with regards to Package design

• Minimum 5 years of experience in IC Package Design
• Strong knowledge of Electronic IC Packaging technology, including Thermal and Mechanical
• IC Package design experience of the overall structure, and RLC extraction
• Can use relevant software e.g. Cadence/Ansys and AutoCAD tool

• Understanding of IC physical layout
• Strong communication, organisation and interpersonal skills
• Proficient in liaising with external assembly vendors

If you want to excel your career in a fast growing company, contact Ella Flynn @IC Resources.

Mid‑Senior level

Full‑time

Engineering and Information Technology

Staffing and Recruiting