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Principal Application Engineer _ Semiconductor Advanced

Job in Irvine, Orange County, California, 92713, USA
Listing for: Henkel Corporation
Full Time position
Listed on 2026-03-01
Job specializations:
  • Engineering
    Materials Engineer, Process Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below
Position: Principal Application Engineer _ Semiconductor Advanced Package

At Henkel, you’ll be part of an organization that’s shaping the future through innovation, sustainability and collaboration. With our trusted brands like Persil®, ‘all®, Loctite®, Snuggle®, and Schwarzkopf® and our cutting-edge technologies, you’ll have countless opportunities to explore new paths and grow.

This position is with our Adhesive Technologies business unit – where we empower our people to transform industries and provide our customers with a competitive advantage through adhesives, sealants and functional coatings.

Dare to learn new skills, advance in your career and make an impact at Henkel.

What you´ll do

You will be the technical lead helping customers successfully adopt Henkel’s advanced packaging materials. Your work directly impacts performance and reliability of next-generation semiconductor packaging technologies.

  • Serve as the technical lead for Henkel’s advanced semiconductor packaging materials.
  • Work directly with customers to optimize wafer or panel-level encapsulation and molding processes.
  • Troubleshoot complex material and process issues for both developmental and commercial products.
  • Ensure successful product adoption by delivering clear, measurable value to customers.
  • Solve technology-specific challenges across product lines through innovative application development and material characterization.
  • Collaborate closely with R&D, sales, and product teams to translate customer needs into technical solutions.
What makes you a good fit
  • Bachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field.
  • 10+ years of experience in semiconductor advanced packaging materials or processes.
  • Strong expertise in wafer-level encapsulation and molding technologies.
  • Solid understanding of current and emerging packaging trends, including 2.5D and 3D packaging.
  • Proven ability to work independently and lead technical discussions with customers.
  • Strong communication skills with a customer-focused, ownership-driven mindset.
  • Effective project and time management skills, with a consistent focus on quality and delivery.
  • Willingness to travel up to 10%.
Some benefits of joining Henkel
  • Health Insurance: affordable plans for medical, dental, vision and wellbeing starting on day 1
  • Work-Life Balance:
    Paid time off including sick, vacation, holiday and volunteer time, flexible & hybrid work policies (depending on role), and vacation buy / sell program
  • Financial: 401k matching, employee share plan with voluntary investment and Henkel matching shares, annual performance bonus, service awards and student loan reimbursement
  • Family Support: 12-week gender neutral parental leave (up to 20 weeks for parents giving birth), fertility support, adoption & surrogacy reimbursement, discounted child and elderly care, and scholarships
  • Career Growth: diverse national and international growth opportunities, access to thousands of skills development courses, and tuition reimbursement

The salary for this role is $- $. This is the range that we in good faith anticipate relying on when setting wages for this position. We may ultimately pay more or less than the posted range and this range. This salary range may also be modified in the future.

Henkel is an equal opportunity employer. We evaluate qualified applicants without regard to race, color, religion, sex, age, national origin, disability, veteran status, genetic information, and other legally protected categories.

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