Thermal​/Mechanical Engineer

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Thermal/Mechanical Engineer

Reports To:
Vice President, Systems Engineering

Company Overview

Netlist Inc. (NASDAQ: NLST) is a leading provider of high-performance modular memory subsystems and next-generation storage-class memory solutions. We specialize in cutting-edge technologies that enable innovation in AI, cloud computing, and enterprise infrastructure. Our product portfolio includes DDR4/DDR5 DIMMs, NAND-based SSDs, and advanced interconnect technologies such as CXL and PCIe.

Thermal/Mechanical Engineer

Reports To:
Vice President, Systems Engineering

Company Overview

Netlist Inc. (NASDAQ: NLST) is a leading provider of high-performance modular memory subsystems and next-generation storage-class memory solutions. We specialize in cutting-edge technologies that enable innovation in AI, cloud computing, and enterprise infrastructure. Our product portfolio includes DDR4/DDR5 DIMMs, NAND-based SSDs, and advanced interconnect technologies such as CXL and PCIe.

Join our world-class engineering team and be part of shaping the future of memory and storage architecture.

Position Summary

Netlist is looking for an exceptional Thermal/Mechanical Engineer to develop thermal solutions for memory and storage products for sale to top tier OEMs/ODMs and Hyperscalar customers.



Key Responsibilities

• Create mechanical and thermal models of electrical and mechanical assembles either from scratch or from PCB CAD files
• Source or design thermal solutions for memory and storage products.
• Run thermal simulations to verify the thermal solutions meet the specified requirements
• For custom designs, specify all the required materials and create fabrication and assembly drawings as necessary
• Create and implement Design of Experiments (DoEs) to evaluate thermal properties of electrical assemblies
• Feedback concerns and suggestions to electrical team
• Create assembly drawings which specify the assembly process
• Work with manufacturing to ensure that assemblies are created properly

• BSEE or MSEE (preferred) in Mechanical Engineering, Thermal Engineering, or related field of study with 8+ years of directly related industry experience in IC Packaging Design.
• Must have knowledge of mechanical drawing tools (AutoCAD, Solid Works, etc.)
• Must have knowledge of thermal analysis/simulation tools (Flowtherm, Icepak, etc.))
• Knowledge of thermal materials (IC heat sinks and heat spreaders, thermal greases and epoxies, thermal gap pads, etc.) is desirable.
• Must possess the drive to innovate and tackle new challenges.
• Must possess good communication skills and professionalism in representing his/her work.
• Must have excellent problem-solving skills
• Must have strong interpersonal skills, stakeholder management, communication and influencing skills
• Must have the ability to assume responsibility and be proactive in taking initiative to address issues, set direction and meet commitments
• Knowledge of memory/storage components (DDRx, LPDDRx, NAND) and modules (DIMMs, SSDs, etc.) is very desirable.
• Physical demands for an office position with heavy computer use
• Ability to travel (less than 10%)

• Seniority level
  
  Mid-Senior level

• Employment type
  
  Full-time

• Job function
  
  Engineering and Information Technology
• Industries Semiconductor Manufacturing

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