Process Engineering Expert; Sr. Principal Engineer

Overview

We are seeking a highly skilled and experienced Process Engineering Photonics Expert to join our team at the InP Phonoics fabrication facility. This role is crucial in driving the development, implementation, and continuous improvement of advanced semiconductor and photonics fabrication processes. This role requires a deep understanding of III‑V materials, hands‑on expertise in cleanroom environments, and a proven track record of driving innovation in wafer processing technologies.

• Lead the design, development, and optimization of InP wafer processing techniques, including Epitaxy, Photolithography, Deposition, Etching and Metrology.
• Collaborate with cross‑functional teams to ensure seamless integration of wafer processes into device manufacturing workflows.
• Develop and execute Design of Experiments (DOE) to improve process reproducibility, yield, and device performance.
• Troubleshoot and resolve process‑related challenges, ensuring high‑quality output and minimal downtime.
• Mentor and guide junior engineers and technicians, fostering a culture of continuous learning and innovation.
• Stay updated on industry trends and emerging technologies to maintain a competitive edge in wafer processing.
• Document all process steps, create detailed work instructions, and ensure compliance with quality and safety standards.
• Present technical findings and recommendations to internal stakeholders and management.

• Ph.D. degree in Materials Science, Physics, Chemistry, Electrical Engineering, or a related field.
• 15+ years of experience in semiconductor wafer processing, with a focus on III‑V materials like InP or GaAs.
• Deep knowledge of photonics wafer processing techniques.
• Strong analytical skills with experience in statistical process control and data interpretation.
• Excellent communication and leadership abilities.
• Familiarity with industry standards and best practices in semiconductor manufacturing.

• Experience with photonic device fabrication.
• Knowledge of advanced sensor chip assembly processes.
• Proficiency in using simulation tools for process optimization.
• Hands‑on experience in InP fab.
• Proficient with lean manufacturing methods.

• 33 days annual leave entitlement per year (including UK public holidays)
• Group Personal Pension
• Life insurance
• Free onsite parking
• Private medical insurance
• Medical expense claim scheme
• Employee Assistance Program
• Cycle to work scheme
• Company sports club and social events
• Additional time off for learning and development