Senior​/Principal TCAD Engineer

Senior/Principal TCAD Engineer

Texas Institute for Electronics (TIE) is a transformative, well‑funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative. Our mission is to advance the state of the art in 3D heterogeneous integration, chiplet‑based architectures, and multi‑component microsystems, catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high‑performance computing, and next‑generation healthcare devices.

Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.

TIE’s 3

DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to reimagine an industry from the ground up and build transformative products with global impact.

• Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
• Voluntary Vision, Dental, Life, and Disability insurance options
• Generous paid vacation, sick time, and holidays
• Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
• Additional Voluntary Retirement Programs:
  Tax‑Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
• Flexible spending account options for medical and childcare expenses
• Robust free training access through Linked In Learning plus professional conference opportunities
• Tuition assistance
• Expansive employee discount program including athletic tickets
• Free access to UT Austin’s libraries and museums with staff
• Free rides on all UT Shuttle and Austin Cap Metro buses with staff

Develop and validate multi‑physics, silicon‑calibrated TCAD models for 3

DHI devices and interfaces to predict performance and reliability. Partners across teams and external vendors co‑optimize designs, set modeling best practices, deliver reusable reference flows, and mentor engineers.

• Develop and own TCAD modeling frameworks for advanced devices and interfaces relevant to 3
  
  DHI, including hybrid bonding contacts, TSVs, BEOL interconnects, and emerging device structures.
• Perform multi‑physics simulations (electrical, thermal, mechanical, and reliability) to predict performance, variability, and failure mechanisms across stacked, heterogeneous die systems.
• Co‑optimize devices, interconnect, and packaging designs by working closely with process integration, packaging, and circuit teams to close the loop between fabrication, measurement, and simulation.
• Calibrate and validate TCAD models using silicon data from wafer‑level test vehicles and process monitors; drive model‑to‑hardware correlation across corners and stress conditions.
• Define simulation methodologies and best practices for 3D device and interface modeling (e.g., contact resistance, current crowding, electromigration, thermo‑mechanical stress).
• Engage with foundry, EDA, and materials partners to influence next‑generation TCAD tool features and process design enablement for 3D‑stacked systems.
• Author technical documentation, modeling guidelines, and reference flows to support ecosystem adoption of TIE’s device and interface platforms.
• Mentor junior engineers and technical staff, setting standards for modeling rigor and engineering judgment across the organization.

• Ph.D. or M.S. in Electrical Engineering, Materials Science, Applied Physics, or a closely related field with strong emphasis on device physics and numerical simulation.
• 8+ years (Senior) or 12+ years (Principal) of hands‑on experience with TCAD for semiconductor devices or interconnects.
• Deep understanding of semiconductor device physics (MOSFETs, diodes, contacts) and transport mechanisms relevant to nanoscale and 3D structures.
• Proficiency with commercial TCAD tools such as Synopsys Sentaurus, Silvaco Atlas/Victory, or…