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Advanced Packaging Module Engineer - Drive -Gen Tech
Job in
Hillsboro, Washington County, Oregon, 97104, USA
Listed on 2026-03-12
Listing for:
Intel Corporation
Full Time
position Listed on 2026-03-12
Job specializations:
-
Engineering
Manufacturing Engineer
Job Description & How to Apply Below
A leading semiconductor company in Oregon is seeking a Module Development Engineer to lead the design and development of sophisticated manufacturing processes. This role requires driving technology for high volume manufacturing and performing feasibility studies for innovative device architectures. Candidates must have a degree in materials or engineering and relevant experience, with a strong focus on wafer level assembly procedures.
The position offers competitive compensation and excellent benefits.
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