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Advanced Packaging Module Engineer - Drive -Gen Tech

Job in Hillsboro, Washington County, Oregon, 97104, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-03-12
Job specializations:
  • Engineering
    Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 133800 - 188890 USD Yearly USD 133800.00 188890.00 YEAR
Job Description & How to Apply Below
Position: Advanced Packaging Module Engineer - Drive Next-Gen Tech
A leading semiconductor company in Oregon is seeking a Module Development Engineer to lead the design and development of sophisticated manufacturing processes. This role requires driving technology for high volume manufacturing and performing feasibility studies for innovative device architectures. Candidates must have a degree in materials or engineering and relevant experience, with a strong focus on wafer level assembly procedures.

The position offers competitive compensation and excellent benefits.
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