Senior Member of Technical Staff; CMP Engineer
Listed on 2026-03-10
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Engineering
Manufacturing Engineer, Process Engineer
Shape the Future of Semiconductor Innovation at Intel Foundry
Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry.
Position SummaryMDCE is seeking a Senior Member of Technical Staff (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12 nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers.
CoreResponsibilities Technical Leadership
- Process Development & Optimization:
Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes - Cross-Node Alignment:
Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield - Problem Resolution:
Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies
- Customer-Centric Delivery:
Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions - Technology Transfer:
Bridge technology development and manufacturing teams to ensure smooth transition of CMP processes to production - Continuous Improvement:
Drive ongoing optimization initiatives to enhance process capability, yield, and manufacturing efficiency
- Cross-Functional Partnership:
Work closely with Integration, Device, Yield, Factory, Quality, and Customer Engineering teams - Supplier Engagement:
Collaborate with equipment and consumables suppliers to co-develop and optimize CMP solutions - Team Development:
Mentor junior engineers and provide technical guidance across the organization
- Proven Track Record:
History of significant technical accomplishments and successful project delivery - Leadership Capability:
Ability to influence and drive results across multiple organizations and disciplines - Business Acumen:
Understanding of semiconductor industry trends, manufacturing strategies, and customer requirements
- Communication
Skills:
Exceptional ability to communicate complex technical concepts to diverse audiences - Adaptability:
Thrives in ambiguous situations and can drive clarity in complex technical challenges while working effectively in fast-paced, high-pressure environments - Initiative:
Self-motivated with strong persistence and ability to work independently - Quality Focus:
Meticulous attention to detail with commitment to safety, quality, and compliance standards
Minimum Qualifications
- Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
- 7+ years of experience in semiconductor manufacturing / process development or technology development
- 4+ years of direct experience in Chemical Mechanical Planarization (CMP) process development experience with hands-on process tuning and characterization
- Experience with major CMP equipment platforms in one of the following platforms (AMAT, Ebara, etc.)
- Experience with CMP consumables (e.g. slurries, pads, conditioning disks, filters, clean chemistries)
- Previous semiconductor foundry experience
- Doctorate in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
- Experience with advanced technology nodes (e.g. sub-10nm logic, specifically in Gate All Around (GAA) architectures) with track record of successful technology development and HVM implementation
- Cross-functional leadership experience, including task force leadership for yield improvement initiatives
- Experience with CMP integration with other process modules (e.g. deposition, lithography, etch, clean) and CMP-relevant metrology with understanding of CMP impact on device performance and yield
- Experience with CMP-relevant metrology and process control (e.g. thickness, topography, defects, roughness, particles)
This role requires in-person collaboration to enable rapid decision-making and effective problem resolution. You'll work in a dynamic, fast-paced environment with competing priorities while maintaining the highest standards for safety, quality, and customer satisfaction.
Impact & GrowthJoin a team that's reshaping Intel's foundry capabilities and directly influencing the success of next-generation semiconductor technologies. This role offers exceptional opportunities for professional growth, technical…
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