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Senior Member of Technical Staff; CMP Engineer

Job in Hillsboro, Washington County, Oregon, 97104, USA
Listing for: Intel
Full Time position
Listed on 2026-03-10
Job specializations:
  • Engineering
    Manufacturing Engineer, Process Engineer
Salary/Wage Range or Industry Benchmark: 60000 - 80000 USD Yearly USD 60000.00 80000.00 YEAR
Job Description & How to Apply Below
Position: Senior Member of Technical Staff (CMP) Engineer

Shape the Future of Semiconductor Innovation at Intel Foundry

Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry.

Position Summary

MDCE is seeking a Senior Member of Technical Staff (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12 nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers.

Core

Responsibilities Technical Leadership
  • Process Development & Optimization:
    Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes
  • Cross-Node Alignment:
    Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield
  • Problem Resolution:
    Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies
Strategic Execution
  • Customer-Centric Delivery:
    Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions
  • Technology Transfer:
    Bridge technology development and manufacturing teams to ensure smooth transition of CMP processes to production
  • Continuous Improvement:
    Drive ongoing optimization initiatives to enhance process capability, yield, and manufacturing efficiency
Collaboration & Leadership
  • Cross-Functional Partnership:
    Work closely with Integration, Device, Yield, Factory, Quality, and Customer Engineering teams
  • Supplier Engagement:
    Collaborate with equipment and consumables suppliers to co-develop and optimize CMP solutions
  • Team Development:
    Mentor junior engineers and provide technical guidance across the organization
Professional Excellence
  • Proven Track Record:
    History of significant technical accomplishments and successful project delivery
  • Leadership Capability:
    Ability to influence and drive results across multiple organizations and disciplines
  • Business Acumen:
    Understanding of semiconductor industry trends, manufacturing strategies, and customer requirements
Personal Attributes
  • Communication

    Skills:

    Exceptional ability to communicate complex technical concepts to diverse audiences
  • Adaptability:
    Thrives in ambiguous situations and can drive clarity in complex technical challenges while working effectively in fast-paced, high-pressure environments
  • Initiative:
    Self-motivated with strong persistence and ability to work independently
  • Quality Focus:
    Meticulous attention to detail with commitment to safety, quality, and compliance standards
Qualifications

Minimum Qualifications
  • Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
  • 7+ years of experience in semiconductor manufacturing / process development or technology development
  • 4+ years of direct experience in Chemical Mechanical Planarization (CMP) process development experience with hands-on process tuning and characterization
  • Experience with major CMP equipment platforms in one of the following platforms (AMAT, Ebara, etc.)
  • Experience with CMP consumables (e.g. slurries, pads, conditioning disks, filters, clean chemistries)
  • Previous semiconductor foundry experience
Preferred Qualifications
  • Doctorate in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
  • Experience with advanced technology nodes (e.g. sub-10nm logic, specifically in Gate All Around (GAA) architectures) with track record of successful technology development and HVM implementation
  • Cross-functional leadership experience, including task force leadership for yield improvement initiatives
  • Experience with CMP integration with other process modules (e.g. deposition, lithography, etch, clean) and CMP-relevant metrology with understanding of CMP impact on device performance and yield
  • Experience with CMP-relevant metrology and process control (e.g. thickness, topography, defects, roughness, particles)
Work Environment

This role requires in-person collaboration to enable rapid decision-making and effective problem resolution. You'll work in a dynamic, fast-paced environment with competing priorities while maintaining the highest standards for safety, quality, and customer satisfaction.

Impact & Growth

Join a team that's reshaping Intel's foundry capabilities and directly influencing the success of next-generation semiconductor technologies. This role offers exceptional opportunities for professional growth, technical…

Position Requirements
10+ Years work experience
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