APTM Yield Defect Metrology Engineer

Job Details: Job Description:

Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life.

Join us and help make the future more wonderful for everyone. Want to learn more? Visit our You Tube Channel or the link below.

Life at Intel

Advanced Packaging / TD is the heart and soul of Moore’s Law  has enabled Intel to create world‑changing technology that enriches the lives of every person on earth. TD’s more than 10,000 employees drive breakthrough research, develop next generation process and packaging technologies, while also running high volume manufacturing operations in its state‑of‑the‑art facilities in Oregon and New Mexico

The process and packaging technology that TD develops is then transferred to Intel’s global network of semiconductor fabrication, assembly and test plants.

This role requires regular onsite presence to fulfill essential job responsibilities.

• Provides process development direction throughout the whole lifecycle of a technology node by identifying root cause yield limiters.
• Performs statistical analysis, develops visualizations and presentations to construct accurate process development roadmaps that drive technology yield milestones.
• Develops methods, processes, and systems to consolidate and analyze diverse big data sources, establishing optimal methodologies for defect mode understanding and yield modeling, leading to accurate yield Pareto construction and process roadmap definition.
• Organizes, interprets, and structures insights from fab process, defect, and electrical data and detects data anomalies and drives process changes for yield enhancement.
• Extracts insights from structured and unstructured data by quickly synthesizing large volumes of data, and applying statistics, machine learning and coding techniques.
• Develops systems to transform complex experimental and manufacturing data into yield improvement actions using knowledge of product design and test features.
• Ensures manufacturability over process and product design through thorough analysis of process and spec corners and works with design to resolve yield issues before manufacturing ramp.
• Executes new product introductions, enables design technology co‑optimization, and participates in design of experiments in factory task forces.
• Creates cross functional collaborations across organizations to debug yield limiters in design, test, and process development areas.
• Develops tools, multivariate algorithms, and methodologies to perform high‑volume data analysis to identify root cause yield limiters and identify key process changes to advance yield improvement.
• Performs fault isolation and failure analysis to determine the root cause of failures by evaluating the electrical characteristics of the components using various tools and techniques such as ATE testing, DFx software tools, optical probing, logic/circuit simulation, and emulation, probing, and layout study.
• Develops measurement recipes to provide quick and accurate feedback on product integrity, helping resolve issues with yield or product quality impact.
• Develops and hardens equipment capable of meeting operational and capability needs for leading edge logic node.

• Proactive and willing to work in a dynamic and team‑oriented environment.
• Enthusiastic collaborator and organizer and a self‑starter.
• Collaborative and interpersonal skills, willing to influence and motivate others.
• Effectively communicate and articulate technical concepts in a clear and concise manner to both line and executive leadership.
• Model based problem‑solving and root cause analysis skills.

• Bachelor’s Degree with 2+ or more years of experience, or a Master’s Degree with 1+ years of experience, or a PhD in one of the following fields:
  Materials Science and Engineering,…