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Wireless Packaging Architect: RF & Thermal Leader

Job in Hillsboro, Washington County, Oregon, 97104, USA
Listing for: Intel
Full Time position
Listed on 2026-01-12
Job specializations:
  • Engineering
    Systems Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below
A leading technology firm is seeking a Silicon Packaging Architect/Engineer to drive innovative semiconductor packaging technology for WiFi, Bluetooth, and mmWave products. The role focuses on RF/Electrical, Thermal, Mechanical, Reliability, and cost optimizations, requiring a Bachelor’s degree in relevant fields and 4+ years of experience. The position emphasizes collaboration with design teams and ensuring regulatory compliance while managing packaging processes.

Competitive salary range from $ to $, with additional benefits and an on-site work model.
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