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Senior Silicon Packaging Architect Wireless ICs
Job in
Hillsboro, Washington County, Oregon, 97104, USA
Listed on 2026-01-12
Listing for:
Intel Corporation
Full Time
position Listed on 2026-01-12
Job specializations:
-
Engineering
Systems Engineer, Packaging Engineer
Job Description & How to Apply Below
A leading multinational technology company is seeking a Silicon Packaging Architect / Engineer in Hillsboro, Oregon to drive innovations in semiconductor packaging for wireless products. The role involves defining packaging specifications, collaborating across teams, and optimizing designs for performance. Candidates should have a relevant degree, experience in technology development, packaging physics, and a strong problem-solving mindset. Competitive compensation and benefits package offered.
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Position Requirements
10+ Years
work experience
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