Wafer Backside Processing Technician - Second Shift

Performs a variety of technical tasks associated with backside wafer processing and assembly operations. This role supports production and engineering priorities in a cleanroom environment, focusing on die preparation, hybridization, wicking, and wire bonding processes.

This is a second shift position from 2:30 pm to 11:00 pm M-F.

• Clean and inspect diced die using approved solvents and cleaning methods
• As needed operate hybridization tools and maintain process parameters for yield optimization

• Perform wicking operations to ensure proper underfill application
• Monitor curing cycles and maintain accurate process logs Wire bonding
  • Inspect bonds for quality and reliability using microscopes and metrology tools
  General Responsibilities
  • Maintain detailed records of SPC charts, tool usage, and consumables
  • Follow ISO Class 6 cleanroom protocols and 6S principles
  • Schedule and coordinate WIP for efficient movement between backside processes
  • Inspect and disposition nonconforming product
  Job Qualifications
  • High School Diploma or equivalent; technical coursework preferred
  • 1–2 years of experience in semiconductor assembly or wafer processing
  • Familiarity with cleanroom operations and chemical handling
  • Ability to read and follow paper and digital travelers
  • Strong attention to detail, communication, and teamwork skills
  Physical Requirements
  • Ability to stand and walk for extended periods (up to 8–10 hours per shift)
  • Frequent bending, stooping, and reaching to handle wafers and assemblies
  • Manual dexterity for handling small components and precision tools
  • Ability to lift and carry items up to 25 lbs
  • Comfortable working in full cleanroom gowning (coveralls, gloves, mask, eye protection)
  • Visual acuity for detailed inspection under microscopes