Semiconductor Process Engineer

Basic Qualifications

• Bachelor's degree from an accredited college in Engineering, Physics, or a related discipline.
• Experience in semiconductor packaging or FPA manufacturing in a cleanroom environment, with demonstrated expertise in flip‑chip hybridization techniques or related processes such as epoxy die attach/bonding, polishing, substrate removal, or anti‑reflection (AR) coating.
• Must be a U.S. citizen; this position is located at a facility that requires special access.

You will be a Focal Plane Array Process Engineer with our Infrared Sensors Business on site in Goleta, CA. Our team is responsible for developing and manufacturing advanced focal plane arrays (FPAs), and we are looking for a talented engineer to join our team.

As a Staff FPA Process Engineer you will provide technical and production leadership in the fabrication and execution of advanced FPAs, including wicking, plasma system, substrate thinning, dicing, anti‑reflection coating, and flip‑chip bonding for hybridization. Your work will focus on developing and optimizing processes, procedures, tooling, and equipment to maximize yield, efficiency, and throughput, and on the precise alignment and bonding of detector arrays and readout integrated circuits (ROICs) to create high‑performance FPAs.

• Work with development and process integration engineers to adapt new processes and techniques into the manufacturing line as required, including defining requirements for new capabilities and leading FPA processing equipment capital procurement projects.
• Lead projects related to process definition, fabrication, modification and evaluation of FPA devices and components.
• Analyze test data, identify trends and anomalies, and provide feedback to drive process control and improvement initiatives. Contribute to the troubleshooting and failure analysis of FPAs, identifying root causes and implementing corrective actions.
• Develop and maintain documentation, including workflows, work instructions, and process control checklists, ensuring adherence to quality standards and industry protocols.

• 9+ years of industry experience, or an advanced degree in Materials Engineering, Chemical Engineering, Mechanical Engineering, or Physics with 7+ years of industry experience.
• Background in IR FPA packaging, specifically flip‑chip hybridization techniques.
• Knowledge of semiconductor device physics, photodetectors, and FPAs.
• Proficiency in MS Office (Word, PowerPoint, Excel).
• Excellent engineering documentation skills and communication skills.
• Ability to interface effectively from technician level to senior management with excellent written and verbal communication and interpersonal skills.
• Experience leading multifunctional teams.
• Ability to multi‑task, organize and prioritize assignments independently.
• Experience in Design of Experiments (DOE), statistical process control (SPC), and data analysis software packages (e.g., JMP).
• Experience with Lean/Six Sigma methodologies and data analysis software such as MATLAB or JMP.

We offer a collaborative and innovative environment where you can work on cutting‑edge technology and contribute to the advancement of FPA technology. Our commitment to work‑life balance and overall well‑being supports your success and well‑being.

MUST BE A U.S. CITIZEN – This position is located at a facility that requires special access.

Goleta, CA (Santa Barbara area)

By applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match. If so, you may be contacted for this and future openings.

First shift. 4x10 hour day, 3 days off per week. Work is on‑site full‑time.

Lockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.

The application window will close in 90 days; applicants are encouraged to apply within 5‑30 days of the requisition posting date in order to receive optimal consideration.

Annual base salary range for…