More jobs:
Semiconductor Process Engineer
Job in
Goleta, Santa Barbara County, California, 93117, USA
Listed on 2026-03-04
Listing for:
Lockheed Martin
Full Time
position Listed on 2026-03-04
Job specializations:
-
Engineering
Process Engineer, Manufacturing Engineer
Job Description & How to Apply Below
*
* Description:
*
* You will be a Focal Plane Array Process Engineer with our Infrared Sensors Business on site in Goleta, CA Our team is responsible for developing and manufacturing advanced Focal Plane Arrays FPAs , and we are looking for a talented engineer to join our team
** What You Will Be Doing*
* As a Staff FPA Process Engineer, you will be responsible for the technical and production leadership in the fabrication and execution of advanced Focal Plane Array FPA including wicking, plasma system, substrate thinning, dicing, Anti Reflection AR coating, and flip chip bonding for hybridization, a key step in the manufacturing process imaging devices You will play a critical role in developing and optimizing the processes, procedures, tooling, and equipment to maximize yield, efficiency, and throughput and methodologies used to precisely align and bond detector arrays and readout integrated circuits ROICs , creating high performance FPAs You'll work in a fast paced, high mix production environment and contribute to the advancement of FPA technology
Assignments include the definition of processing and handling equipment requirements and specifications, review of processing techniques and methods applied in the manufacture, fabrication, and evaluation of FPA devices
Your responsibilities will include, but are not limited to:
+ Work with development and process integration engineers to adapt new processes and techniques into the manufacturing line as required This may include defining requirements for new capabilities and organizing, leading, and executing FPA processing equipment capital procurement projects
+ Responsible for projects related to process definition, fabrication, modification and evaluation of FPA devices and components
+ Analyze test data, identify trends and anomalies, and provide feedback to drive process control and improvement initiatives Contribute to the troubleshooting and failure analysis of FPAs, identifying root causes and implementing corrective actions
+ Develop and maintain documentation, including workflows, work instructions, and process control checklists, ensuring adherence to quality standards and industry protocols
** Why Join Us*
* We're looking for a collaborative and innovative Focal Plane Array Process Engineer to join our team As a key member of our Infrared Sensors Business, you will have the opportunity to work on cutting edge technology, contribute to the advancement of FPA technology, and collaborate with a team of experts If you're a motivated and experienced engineer with a passion for process engineering and a strong background in semiconductor manufacturing, we encourage you to apply
We are committed to supporting your work life balance and overall well being Learn more about Lockheed Martin's comprehensive benefits package here
** Further Information About This Opportunity:*
* This position is located in Santa Barbara Discover more about our Santa Barbara, California location
MUST BE A U S CITIZEN This position is located at a facility that requires special access
*
* Basic Qualifications:
*
* - Bachelors degree from an accredited college in Engineering, Physics, or related discipline
- Experience in semiconductor packaging or FPA manufacturing in a cleanroom environment with demonstrated expertise in either flip chip hybridization techniques or related processes, such as epoxy die attach/bonding, polishing, substrate removal, or Anti Reflection AR coating or semiconductor packaging techniques
- Must be a US Citizen, as this position is located at a facility that requires special access
** Desired
Skills:
*
* - 9 years of industry experience OR advanced degree in Materials Engineering, Chemical Engineering, Mechanical Engineering, or Physics with 7 years of industry experience
- Background in IR FPA packaging, specifically flip chip hybridization techniques
- Knowledge of semiconductor device physics, photodetectors, and FPAs
- Proficiency in MS Office Word, PowerPoint, Excel
- Excellent engineering documentation skills and communication skills
- Ability to interface effectively from the technician level to senior management with excellent communication written and verbal and interpersonal skills, with the ability to collaborate effectively with cross functional teams and train technical staff
- Experience leading multifunctional teams
- Ability to multi task, organize and prioritize assignments independently
- Experience in Design of Experiments DOE , statistical process control SPC , and data analysis software packages e g , JMP
- Experience with Lean/Six Sigma methodologies and data analysis software such as MATLAB or JMP
** Clearance Level:
** None
** Other Important Information You Should Know*
* ** Expression of Interest:
** By applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match Should this match be…
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
Search for further Jobs Here:
×