Wafer Fab Process Engineer

Be visionary

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

As part of the uncooled detector (focal plane array) research and development team, the successful candidate will have responsibility for engineering wafer fab processes including plasma etch, thin film deposition, lithography, and wet cleans for next generation infrared detector designs. Candidate will design and implement new processes and automate or improve existing ones to support aggressive technology development goals. They will also own different tools and associated modules in the area.

Candidate will characterize wafers and devices using SEM and or FIB/SEM. As part of process development, hands-on wafer fabrication and characterization of pilot lots is required. This is the right place for a self-directed, goal-oriented, collaborative engineer. The work is varied and challenging where creative problem-solving opportunities are many. Our culture is collaborative, supportive, and fun. The work environment is mixed general office and clean room/lab.

• Innovate new processes to enable the technology roadmap
• Design and execute experiments, analyze data, draw conclusions, document, and communicate results
• Own tools and process modules in the area
• Establish feasibility of new processes through hands‑on processing of pilot lots on production equipment
• Characterize results using quantitative metrology tools
• Automate or improve established processes
• Document methods and workflows in MES‑ready format
• Plan for statistical process control (SPC) practices as appropriate
• Evaluate production yield challenges and recommend improvements

• Bachelor's degree or equivalent experience in related technical discipline required
• 0-5 years of related experience desired
• Proficient computer skills – Word, Excel & Outlook
• Ability to communicate clearly in written and spoken English
• Strong data analysis skills (fluency in Excel, MatLAB JMP, Python, SQL, or equivalent is helpful)
• Ability to use inspection equipment (microscopes, FIB/SEM, interferometers), semiconductor fabrication equipment, and wet bench chemistry
• Direct experience with one or more key wafer fabrication processes
• Familiarity and/or strong desire to learn microelectronic/semiconductor and MEMS fabrication techniques
• Applicants must be either a U.S. citizen or Perm Resident

• Wafer processing tools for semiconductor or MEMS fabrication
• Infrared detector technology
• Statistical Process Control and Design of Experiments familiarity desired
• Lean Six Sigma or other problem solving/decision making methods (8D, Kepner-Tregoe, or equivalent)

• Competitive Salary & Benefits Package
• Health, Dental, Vision, and Life Insurance starting Day 1
• Paid Vacation, Sick Time, and Holidays
• 401(k) with Company Match
• Employee Stock Purchase Plan
• Tuition Reimbursement for Education
• Fun Employee Events throughout the year

$90,800.00-$

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws.