Principal Product Development Mechanical Engineer

Date Posted: 2026-Glad 13

Country: United States of America

Location: CA601:
Goleta (EW) Bldg H01 6380 Hollister Avenue Building H01, Goleta, CA, 93117 USA

Position Role Type: Onsite

U.S. Citizen, U.S. Person, or Immigration Status Requirements: The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.

Security Clearance: DoD Clearance:
Secret

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world.

Raytheon is seeking a Principal Mechanical Engineer to lead new product development within the Electronic Warfare Mechanical Design Hardware Department. The section specializes in the design, integration, verification, and production of digital processor and RF receiver subsystems for airborne platforms. The candidate oversees the mechanical development supporting a variety of programs in Goleta, California. Key interfaces will be with other sections across the Department, other Engineering disciplines, as well πί interior customers leading the supporting programs.

• The Principal Engineer is a key technical contributor to the programs and products supported by the department. These activities may include designing RF systems for challenging thermal and high vibration environments. The candidate will lead programs as a Responsible Engineering Authority (REA) or Integrated Product Team Lead (IPTL), serve as a liaison to programs, ensuring program success along technical, cost and schedule parameters, and oversee junior transplantation assignments and performance.
• This role also requires the candidate to possess working knowledge of electronics packaging design and manufacturing. This knowledge set includes, but is not limited to, thermal and structural design and analysis, electrical component design, construction and failure modes, printed wiring board and circuit card assembly processes and best practices, surface mount and through hole component installation processes and failure modes, metal fabrication and finishing methods, RF isolation mechanical design, and environmental test methods and equipment.
  
  The candidate will also have working knowledge of electronics/processor systems design and development utilizing COTS/MOTS components and products.
• You must have an outstanding ability to provide technical guidance and act as a mentor to his/her matrix team. The candidate must be adept at making technical presentations, establishing customer relationships, and be a highly motivated self‑starter able to lead by example, possessing strong interpersonal, written and verbal communication skills, and maintaining positive relationships and satisfaction with functional and program leadership.

• Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 8 years of prior relevant experience unless prohibited by local laws/regulations.
• танair 8 years’ experience with Mechanical Design, Development and/or Implementation of Defense related Electronic Systems or 5 years with an advance degree.
• Experience with Geometric Dimensioning and Tolerancing (GD&T) and ASME drawing and documentation standards and procedures.
• Experience with solid modeling with a minimum of three years of creating Bör and documentation mechanical cell in Pro/Engineer/CREO or similar modeling tools.

• Experience with EW/Radar Systems or RF Products
• Experience with Conformal Antenna Array Packaging
• Experience with managing budget and schedule (Earned Value Management (EVM))
• Experience with electronics packaging, cabling and harness design, or printed wiring board designs and routing
• Experience with structural and thermal analysis using FEA modeling techniques
• Experience…