Silicon Packaging Architect​/Engineer

Overview

Silicon Packaging Architect / Engineer at Intel Corporation. Join Intel's Wireless Communications Solutions (WCS) team to drive semiconductor packaging technology for WiFi, Bluetooth, and mmWave products, focusing on RF/Electrical, Thermal, Mechanical, Reliability, and Cost optimization.

• Strategic Leadership and Architecture:
  Translate product requirements into comprehensive package architecture specifications; lead technology trade-off decisions to ensure packages meet electrical, mechanical, thermal, and reliability standards; define overall product package performance specifications and drive technology certification; oversee end-to-end package development processes from design through production.
• Technical Excellence and Innovation:
  Troubleshoot complex packaging problems and develop innovative, cost-effective solutions; research packaging assembly materials and properties, establishing specifications for suppliers; perform mechanical and reliability simulations to optimize package design; conduct thermal performance simulations using predictive FEA analysis.
• Cross-Functional Collaboration:
  
  Partner with silicon, hardware, and package design teams to ensure high-quality deliverables; coordinate with internal/external manufacturing partners (OSATs) and substrate suppliers; support product co-design and layout teams as manufacturing liaison; collaborate with Quality & Reliability teams to ensure products meet specifications; complete DFMEA assessments with assembly suppliers to evaluate technology risks.
• Manufacturing and Process Management:
  Ensure seamless transition from design to high-volume production; design and validate Test Vehicles for process characterization; provide consultation on packaging improvements and process optimization.

You must possess the below minimum qualifications. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor. Experience listed below would be obtained through a combination of your degree, research and/or relevant previous job and/or internship experiences.

This position is not eligible for Intel immigration sponsorship.

Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science/Engineering, Physics, or related field + 4+ years industry experience OR Master's degree in relevant field + 3+ years experience OR PhD in relevant field + 1+ years experience

• 2+ years package assembly technology development experience
• 2+ years packaging physics (mechanical and thermal) and/or materials experience
• 2+ years package assembly manufacturing processes and HVM ramp experience

• Semiconductor device physics and process engineering experience
• RF Component Packaging experience (highly valued for wireless products)
• Testing systems experience with hardware/software (Matlab, Lab View)

• Strong project management capabilities
• Proficiency in Microsoft Office Suite
• Excellent communication and presentation abilities
• Self-driven with strong problem-solving tenacity
• Action-oriented mindset

• Job Type: Experienced Hire
• Shift: Shift 1 (United States of America)
• Primary
  
  Location:
  
  US, California, Santa Clara
• Additional Locations: US, Arizona, Phoenix; US, California, Folsom; US, Oregon, Hillsboro

You’ll be at the forefront of wireless technology innovation, directly impacting next-generation WiFi, Bluetooth, and mmWave solutions that connect the world.

The Silicon Engineering Group (SIG) focuses on the development and integration of SOCs, Cores, and critical IPs from architecture to manufacturing readiness that power Intel’s leadership products. Intel’s Wireless Communications Solutions (WCS) group ensures regulatory compliance and quality through rigorous product regulatory life cycle management aligned with global standards.

We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and benefit programs covering health, retirement, and vacation. Annual Salary Range for jobs which could be performed in the US: $ -  USD. The range reflects minimum and maximum target compensation across all US locations. Specific location determines final range.