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Wireless Packaging Architect & Engineer: RF​/Thermal Innovation

Job in Folsom, Sacramento County, California, 95630, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-01-12
Job specializations:
  • Engineering
    Systems Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below
A leading tech company is seeking a Silicon Packaging Architect/Engineer to join their Wireless Communications Solutions team. You will drive the semiconductor packaging technology for next-generation products, collaborating with cross-functional teams to optimize design and performance. Candidates must have a Bachelor's degree in a relevant field and substantial experience in packaging technologies.

This role offers competitive compensation and opportunities for growth within the technology sector.
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