Head of NLX R&D Technology Integration and inter-face management

About Us:

How many companies can say they've been in business for over 177 years?!

Here at ZEISS, we certainly can! As the pioneers of science, ZEISS handles the ever changing environments in a fast-paced world, meeting it with cutting edge of technologies and continuous advancements. ZEISS believes that innovation and technology are the key to a sustainable future and solutions for global change. We have a diverse range of portfolios throughout the ZEISS family in segments like, Industrial Quality & Research, Medical Technology, Consumer Markets and Semiconductor Manufacturing Technology.

We are a global company with over 46,000 employees and have over 4,000 in the US and Canada alone! Make a difference, come join the team!

This role serves as the integrative execution leader for the NLX platform within FoB Advanced Packaging in Dublin, CA. The position is responsible for ensuring technical excellence, regulatory compliance, and operational readiness as next-generation semiconductor packaging technologies transition from R&D and pilot environments into high-volume manufacturing.

Reporting to the Head of Product Management NLX, this leader aligns engineering, software, manufacturing, regulatory, safety, service, and advanced roadmap initiatives to deliver cohesive, deployable, and commercially viable systems.

• Provide strategic and technical leadership to Dublin-based NLX support teams, including system engineering and platform development.
• Lead implementation of major hardware upgrades and platform enhancements in alignment with the product roadmap.
• Oversee release and lifecycle management of acquisition and reconstruction software, ensuring performance, reliability, scalability, and maintainability.
• Direct system testing, qualification, and validation activities in close collaboration with manufacturing and integration teams to support tool industrialization and deployment.
• Drive continuous improvement through structured software and system upgrades aligned with evolving customer requirements and roadmap objectives.

• Act as a senior technical leader and primary interface across engineering, manufacturing, quality, regulatory, service, and product strategy organizations within FoB in Dublin.
• Provide mentorship and direction to senior engineering leaders and cross-functional teams.
• Ensure alignment between technical execution, regulatory requirements, and business objectives.
• Partner closely with internal stakeholders and external collaborators to align laboratory innovations with assembly, test, and reliability requirements.
• Build and institutionalize technical knowledge to enable sustainable growth and organizational scalability.

• Drive execution of advanced roadmap initiatives by coordinating R&D, engineering, and technology teams.
• Ensure cross-organizational alignment for development of advanced reconstruction algorithms, resolution enhancement initiatives, and other defined roadmap deliverables.
• Integrate execution across validation tools, detector development, source improvements, simulation activities, and algorithm advancement to achieve system-level performance gains.
• Partner with Product Strategy (including Lead System Engineers and Lead Product Architects), R&D, and business leadership to translate advanced technologies into commercially viable solutions.
• Collaborate with strategic partners on joint development and qualification of emerging semiconductor packaging technologies.

• Own the completion, quality, and governance of all NLX documentation, including development, mechanical, electrical, service, and installation documentation.
• Lead global certification efforts, ensuring compliance with applicable standards and regulations (e.g., SEMI S2/S8, CE, KC) across Asia, North America, Europe, and China.
• Ensure ongoing conformity with machine directive requirements and all applicable safety regulations.
• Establish best practices for documentation, data traceability, and structured knowledge transfer…