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Test Technician

Job in Dallas, Dallas County, Texas, 75215, USA
Listing for: Talent 101 Inc
Full Time position
Listed on 2026-01-12
Job specializations:
  • IT/Tech
    Electronics Technician, Electrical Engineering, Systems Engineer, Hardware Engineer
Salary/Wage Range or Industry Benchmark: 60000 - 80000 USD Yearly USD 60000.00 80000.00 YEAR
Job Description & How to Apply Below

About the role

We are seeking a skilled and detail-oriented Eagle Test Technician to perform wafer-level testing using Eagle Test Systems (ETS) automated test platforms. This role supports high-volume production and engineering evaluations, ensuring electrical integrity and yield optimization for ultra-compact packaged devices.

What you'll do
  • Operate Eagle Test Systems (ETS) for wafer-level electrical testing of devices across analog, mixed-signal, and digital domains.
  • Set up and calibrate wafer probers with specific probe cards, ensuring proper alignment and contact quality.
  • Execute and monitor test programs, flagging anomalies and supporting root cause analysis for yield excursions.
  • Perform preventative maintenance on ETS hardware, probe stations, and test interfaces to ensure uptime and accuracy.
  • Collaborate with test and product engineers to validate test coverage, debug failures, and optimize test flows for form factors.
  • Document test results, equipment status, and lot disposition in MES/SPC systems.
  • Support engineering lots, qualification runs, and test program revisions for new designs.
Qualifications
  • Associate’s degree or technical certification in electronics, semiconductor technology, or related field.
  • 2+ years of hands-on experience with Eagle Test Systems or equivalent ATE platforms.
  • Ability to interpret schematics, debug test setups, and analyze electrical measurements.
  • Proficiency with basic software tools (Excel, MES, SPC, test data viewers).
  • Experience with Cadence, Teradyne, or Advantest platforms.
  • Knowledge of low-pin-count testing, leakage, shorts, and parametric analysis for devices.
  • Understanding of package-level reliability risks (e.g., solder ball integrity, pad stress) and how they relate to test results.
  • Strong troubleshooting skills and ability to work independently in a fast-paced fab or OSAT environment.
  • Test floor setting with strict ESD and safety protocols.
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