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Camera Module Design Lead

Job in Cupertino, Santa Clara County, California, 95014, USA
Listing for: Apple Inc.
Full Time position
Listed on 2026-03-10
Job specializations:
  • Engineering
    Electronics Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 60000 - 80000 USD Yearly USD 60000.00 80000.00 YEAR
Job Description & How to Apply Below

Cupertino, California, United States Hardware

Apple is where individual imaginations gather together, committing to the values that lead to great work. Every new product we build, service we create, or Apple Store experience we deliver is the result of us making each other’s ideas stronger. That happens because every one of us shares a belief that we can make something wonderful and share it with the world, changing lives for the better.

It’s the diversity of our people and their thinking that inspires the innovation that runs through everything we do. When we bring everybody in, we can do the best work of our lives. Here, you’ll do more than join something — you’ll add something.

Do you love taking on big challenges that require exceptionally creative solutions? Do you deeply understand how an incredible camera experience should work? As part of our Camera Technologies group, you’ll help design the innovative technology that allows each generation of Apple products to produce photos even more incredible than the last. You’ll design and develop groundbreaking ideas for everything involved in our camera systems, from sensor to lens.

You’ll collaborate with teams across Apple to research, design, develop, test, and qualify camera hardware for Apple products. Together, we’ll craft a magical photography experience that redefines what millions of customers can expect from their cameras. Bring passion and dedication to your job and there's no telling what you could accomplish!

Description

The Camera Hardware Engineering group is responsible for all research, design, development, test, and qualification of camera hardware for Apple products. We are searching for extraordinary Hardware Engineers to take ownership in the development and system integration of very high-performance, compact camera modules and depth-sensing hardware such as the revolutionary 5x Telephoto camera with the 120mm optical zoom integrated into the iPhone 16 Pro and 16 Pro Max!

Responsibilities
  • Definition and trade-off studies of RGB camera optics, sensors, actuator, and packaging.
  • Interaction with optical, electrical, process, controls systems, sensing, test, and mechanical teams on integration of camera hardware into products.
  • Leadership of offshore manufacturing partners on camera design evaluation, product prototype builds, and qualification.
  • Leadership of failure analysis and corrective action implementation at manufacturing sites as well as remotely, including assembly processes, testing, and calibration; parametric-data analysis of end-of-line yield and post-reliability failures.
  • Evaluation and debugging of camera HW at module and product levels for Camera/Depth Design and Integration.
  • Documentation of camera-specific design, test, and manufacturing requirements.
  • International travel may be required to supplier facilities for product development and production bring-up.
Minimum Qualifications
  • Bachelors in a relevant field (Mechanical Engineering, Electrical Engineering, Optics, Mechatronics Engineering or equivalent)
  • Experience in design or manufacturing or integration of optomechanical products
Preferred Qualifications
  • 3+ years of industry experience
  • Experience in camera module or imaging system design and architecture, including optical components, optical sensing, and system integration trade-offs with display technologies
  • Understanding of geometric optics and image quality evaluation, including test charts analysis, algorithm and image signal processing
  • Proficiency in electronic circuit and system design including power delivery, high-speed signal integrity, electrical integration of sensor interfaces
  • Design and analysis of highly constrained, high-volume actuators or translational mechanisms. Experience with mechanical modeling, finite element analysis (FEA) and tolerance stack-up analysis
  • Understanding of compact module manufacturing processes and associated failure analysis techniques. Ability in root-cause and corrective-action analysis
  • Proven track record of successfully delivering new products into mass production on time, meeting yield and efficiency targets

At Apple, base pay is one part of our total compensation package and…

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