Senior Process Engineer - Packaging

IonQ is developing the world's most powerful full‑stack quantum computer based on trapped‑ion technology. We are pushing past the limits of classical physics and current supercomputing technology to unlock a new era of computing. Quantum computing has the potential to impact every area of human society for the better. IonQ’s computers will soon redefine industries like medicine, materials science, finance, artificial intelligence, machine learning, cryptography, and more.

IonQ is at the forefront of this technological revolution.

• Take ownership of and improve our existing packaging processes with respect to yield, throughput, and capability.
• Research and develop new packaging processes to meet next generation product requirements, from conception, to equipment procurement, to IQ‑OQ‑PQ.
• Perform sustaining engineering activities to support the entire packaging process.
• Execute new product introduction activities, including hands‑on prototype builds from component procurement to characterization.
• Lead failure analysis efforts to identify root cause and corrective actions for packaging and device failures.
• Develop a deep understanding of system operation requirements and cause‑effect relationships between package/device construction and system performance.

• 6+ years of professional experience or an equivalent combination of education and experience.
• 5+ years of hands‑on experience in a fast‑paced, high‑tech manufacturing environment in the semiconductor industry.
• Experience in micro‑electronics and/or opto‑electronics assembly, using, maintaining, and troubleshooting equipment such as wire bonding machines, solder reflow ovens, hand soldering equipment, epoxy dispense equipment, electrical testing equipment (VNA, DMM, oscilloscope, etc.), and plasma cleaners.
• Experience working in a cleanroom environment (e.g., ISO Class 6 cleanroom with full gowning).
• Ability to work independently and in a team setting, as well as cross‑functionally with various organizations.
• Experience with using CAD software to design fixturing and tooling for packaging processes.
• Ability to perform moderate strenuous physical and repetitive work.
• Excellent verbal and written communication skills.
• Strong computer skills with proficiency in Google Software Suite (Sheets, Slides) and/or MS Office.

• 2+ years of experience packaging and testing complex opto‑electrical devices (laser diodes, optical RF generators, fiber optics communication microelectronics, etc.).
• Knowledge of Ultra High Vacuum (UHV) / Extreme High Vacuum (XHV) packaging techniques, material requirements, and process requirements.
• Experience with electron imaging and analytical chemistry techniques used in microelectronics failure analysis.
• Experience developing electrical test methods for RF and DC electronics, at both device and package levels.

This role is based onsite at our headquarters in College Park, MD, with the option to work remotely one day per week depending on project needs.

Minimal to none.

Approximate base salary range: $123,191 – $161,289. Total compensation includes base, bonus, and equity.

Our US benefits include comprehensive medical, dental, and vision plans; matching 401(k); unlimited PTO and paid holidays; parental/adoption leave; legal insurance; a home internet stipend; and pet insurance.

IonQ is an Equal Employment Opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, or any other protected status. We are committed to equity, justice, and a diverse workforce.