Application Engineer

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This role leads the thermal system and application architecture for Direct‑to‑Chip (D2C) liquid cooling solutions used in AI and ML data centers and serves as the technical authority responsible for defining, assessing, and integrating cooling components at the system level to ensure they meet the performance requirements of current and next‑generation AI and HPC processors. This individual will be a key technical interface for both prospective and existing customers, providing system‑level expertise in liquid‑cooled AI/ML applications.

• Define and evaluate Direct-to-Chip liquid cooling architectures for AI/ML data centers
• Understand and assess the complete thermal path:
  Chip, Package, TIM, Cold Plate, Coolant, CDU, Heat Rejection
• Evaluate system-level trade-offs between thermal performance, cost, complexity, and scalability
• Deep application-level understanding of: cold plates / cold plate assemblies, Thermal Interface Materials (TIMs), Coolant Distribution Units (CDUs), liquid loops and working fluids. (contact mechanics, materials, channel concepts)
• Ability to evaluate and select components as part of an integrated system, not in isolation
• Strong understanding of the thermal characteristics of modern AI/ML chips, including: GPUs, AI accelerators, and high‑end server CPUs, extremely high power densities and heat fluxes, hotspot behavior, transient loads, and package‑level constraints
• Ability to translate chip packaging and roadmap trends (e.g., HBM, chiplets) into cooling architecture decisions

• Proven background in AI/ML data centers and HPC environments
• Understanding of server and rack architectures, availability and redundancy requirements, integration of liquid cooling into existing data center infrastructure, operational, service, and reliability considerations
• Act as the technical contact for customers in AI/ML data center applications
• Support customer discussions on cooling architecture selection, system‑level trade‑offs and constraints, integration of D2C liquid cooling into existing or planned infrastructures
• Translate customer requirements and use cases into technically sound system concepts
• Provide technical credibility in customer meetings, workshops, and technical reviews
• Support early‑stage project evaluations, concept discussions, and feasibility assessments from a system architecture perspective

• Bachelor's Degree in Mechanical Engineering, Physics, Material Sciences or related technical field. May consider relevant work experience in lieu of degree.
• Demonstrated experience in AI/ML data centers or HPC environments
• Strong background in liquid cooling, ideally Direct-to-Chip
• Excellent system‑level and architectural thinking
• Solid understanding of heat transfer and fluid flow principles at application level
• Ability to make and justify technical design and component selection decisions
• Excellent communication skills to clearly explain complex thermal system concepts to both technical and non‑technical stakeholders, including customers
• Travel:
  Up to 25%

Who We Are and What We Are All About:

Rogers Corporation makes tomorrow's innovations possible. Help build a cleaner, safer and more connected world with a career at Rogers, where we make tomorrow’s innovations possible. We rely on a talented workforce to develop our cutting edge, market‑leading material technologies. Our global team develops innovative specialty materials and components that enable technology in a wide array of high‑growth markets. Our customers expect high performance and reliability, so we are always looking for people who can improve processes, get results and represent a best‑in‑class organization.

People are at the heart of all our operations, and we encourage our employees to act with integrity, creativity and excellence to help drive results worldwide.

Why Work for Rogers:

It is our commitment to get “Results, but Results the Right Way.” Rogers offers an exceptional work environment and a value‑driven culture modeled by leadership. Employees have access to developmental opportunities as well as top‑notch benefits…