More jobs:
Product/Quality Manager
Job in
Cambridge, Cambridgeshire, CB5, England, UK
Listed on 2025-12-30
Listing for:
Palma Ceia SemiDesign
Full Time
position Listed on 2025-12-30
Job specializations:
-
Engineering
Quality Engineering, Electronics Engineer
Job Description & How to Apply Below
Product/Test Manager – Cambridge, UK
Palm Ceia Semi-Design (PCS) is a fast-growing, fabless semiconductor company focused on integrated Wi‑Fi and LTE solutions for the IoT marketplace. Senior-level product/quality engineers are needed for its Silicon Operations team in Cambridge, UK.
Essential Duties and Responsibilities- Ensure smooth transition of products from early-stage sampling to high-volume production on time and within the quality and cost expectations.
- Plan and execute qualification and reliability programs for new products to industry standards such as JEDEC.
- Plan and execute initial ramp to production.
- Create and maintain suitable product procedures for NPI & ramp.
- Establish effective quality assurance systems, including product qualification, pre-production ramp, and risk analysis.
- Review product discrepancies or build/yield issues, perform investigations and root cause analysis (8D), coordinate with manufacturing and engineering to resolve problems.
- Write and revise internal procedures and instructions to maintain quality standards and support continuous improvement.
- Provide guidance to all team members and maintain ISO 9001 certification.
- BS/MS degree in Physics, EE or equivalent industrial experience.
- Minimum 4 years of direct experience in high‑tech manufacturing.
- Experience with quality management systems.
- Familiarity with electronic manufacturing systems in the semiconductor industry.
- Strong knowledge of product qualification methods including FA.
- Experience with NPI processes in a fabless semiconductor company.
- Experience working with external suppliers and partners.
- Silicon foundry and OSAT experience.
- Statistical analysis skills (e.g., JMP).
- Understanding of analog/RF and digital IC design methodologies and circuit architectures.
- Familiarity with fab tape‑out process.
- Test engineering knowledge.
- Package substrate design.
- Knowledge of BT, Wi‑Fi, Zigbee or NB‑IoT.
- Effective use of Microsoft Office (Word, PowerPoint, Excel, Outlook, Teams).
- Strong communication skills (written, verbal, and presentation).
- Team‑player with a can‑do attitude.
- Ability to work independently while collaborating in a dynamic environment.
- Ability to manage multiple quality projects simultaneously.
- Attention to detail.
- Willingness to take initiative on varied tasks.
- Knowledge of Mandarin.
- Job Site:
Cambridge, UK - Email resumes to:
- No calls. EOE.
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