Sample Preparation Specialist IV; Chip Assembly & Wire Bonding

Sample Preparation Specialist IV (Chip Assembly & Wire Bonding)

D-Wave (NYSE: QBTS), D-Wave is a leader in the development and delivery of quantum computing systems, software, and services. We are the world’s first commercial supplier of quantum computers, and the only company building both annealing and gate-model quantum computers. Our mission is to help customers realize the value of quantum, today. Our quantum computers — the world’s largest — feature QPUs with sub-second response times and can be deployed on-premises or accessed through our quantum cloud service, which offers 99.9% availability and uptime.

More than 100 organizations trust D-Wave with their toughest computational challenges. With over 200 million problems submitted to our quantum systems to date, our customers apply our technology to address use cases spanning optimization, artificial intelligence, research and more. Learn more about realizing the value of quantum computing today and how we’re shaping the quantum-driven industrial and societal advancements of tomorrow:

You can read more about our company and our innovations in the pages of The Wall Street Journal, Time Magazine, Fast Company, MIT Technology Review, Forbes, Inc.

Magazine, Wired and across many whitepapers.

At D-Wave, we’re helping customers realize the value of quantum computing today and are shaping the quantum-driven industrial and societal advancements of tomorrow.

D-Wave is seeking a Sample Preparation Specialist (Chip Assembly & Wire Bonding) to join our Lab Operations team. In this role, you will build and prepare chip samples for cryogenic testing, including mounting chips on copper base plates, wire bonding to PCB stacks, and soldering delicate connectors. You will work under a microscope, use precision tools, handle lab chemicals safely, and execute repeatable, production-style workflows.

You will contribute to improving procedures for throughput, yield, and maintainability, while learning from senior team members and engineers. This is a hands‑on, entry‑to‑mid‑level role ideal for someone building professional expertise in microelectronics and precision assembly.

While your primary focus is on sample preparation, you will also collaborate with Lab Operations, Packaging, and Engineering teams to support experimental builds, troubleshooting, and process improvements.

• Mount chips to copper base plates using approved adhesives, fixtures, and curing processes
• Hand wire bond aluminum connections; operate manual and automated wire bonders as trained
• Micro‑solder fine‑pitch PCB connectors and jumpers with precision
• Handle, align, and secure parts under a microscope using tweezers, micromanipulators, and torque tools
• Clean samples with approved chemistries (e.g., IPA, acetone, flux removers) and ultrasonic baths as required
• Dismount, package, and store delicate samples for records, shipment, or failure analysis
• Inspect work using microscope visual checks, continuity/resistance tests, basic bond pull/shear checks, and photo documentation
• Record work accurately in travelers, lot and revision tracking, and rework logs
• Maintain tools, fixtures, and workstations in an organized and safe manner
• Contribute to process improvements by updating procedure documentation, introducing jigs/fixtures, and suggesting workflow optimizations
• Collaborate with Lab Operations, Packaging, and Engineering teams on priorities, nonconformances, and design feedback
• Follow established procedures consistently while learning to troubleshoot and optimize workflow steps
• Take ownership of assigned tasks, elevate issues when necessary, and actively seek guidance to build technical knowledge

• 5+ years of demonstrated practical skills and applied technical knowledge; formal education (degree or technical diploma in engineering, physics, materials science or related field) is valued but not required
• 3+ years of hands‑on technical experience in microelectronics, precision assembly, or related hands‑on lab work
• Proven dexterity and patience for precision, repetitive tasks under a microscope
• Experience with micro‑soldering and fine‑pitch connectors; basic wire bonding…