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Undergrad Thermal Engineering Intern - Oracle Cloud Infrastructure; OCI - Burlington, MA

Job in Burlington, Middlesex County, Massachusetts, 01805, USA
Listing for: Ll Oefentherapie
Apprenticeship/Internship position
Listed on 2026-03-12
Job specializations:
  • Engineering
    Software Engineer, Mechanical Engineer, Engineering Design & Technologists
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below
Position: Undergrad Thermal Engineering Intern - Oracle Cloud Infrastructure (OCI) - Burlington, MA

Undergrad Thermal Engineering Intern - Oracle Cloud Infrastructure (OCI) - Burlington, MA

Burlington, MA, United States

Trending

  • Job Identification 321197
  • Job Category All Roles
  • Job Type Student/Intern
  • Does this position require a security clearance? No
  • Years See Job Description
  • Additional Info Visa / work permit sponsorship is not available for this position
  • Applicants are required to read, write, and speak the following languages English
Job Description

Must be enrolled in a Bachelor’s Degree program prior to and post internship.

Target Internship Duration: May-Aug 2026 or June-Sept 2026.

Location: this position is fully in office, in Burlington, MA.

Visa sponsorship is not available for this role. For clarity purposes, this means that Oracle is not in a position now, or in the future, to offer US immigration sponsorship. This includes, but is not limited to, support of H-1B, TN, O-1, green card or F-1 e.g. EAD, OPT, CPT, I-20, F-1 visa stamp etc.

The Oracle Hardware Development (OHD) organization in Burlington, MA is looking for a Thermal Mechanical intern to work with our mechanical and thermal design team to support all phases of our development life-cycle, including design, simulation, documentation, and testing/validating prototype thermal designs and measuring airflow in our HW lab.

The Company:

Oracle is the world’s leading provider of business software. With a presence in over 175 countries, we are one of the biggest technology companies on the planet. We're using innovative emerging technologies to tackle real-world problems today. From advancing energy efficiency to reimagining online commerce, the work we do is not only transforming the world of business—it's helping advance governments, power nonprofits, and giving billions of people the tools they need to outpace change.

For more information about Oracle (NYSE:

ORCL), visit us at

Responsibilities

What You’ll Do:

We are seeking elite students with the expertise and passion for solving challenging unique problems. You will use your knowledge and creativity to design and build innovative new systems from the ground up. You will be working on new and challenging thermal and mechanical designs, handle mechanical and thermal models, performing thermal and airflow simulations and testing new thermal solutions in our labs.

You will have the opportunity to work on cutting‑edge technologies to tackle real‑world problems in a collaborative, agile environment.

What You’ll Bring: (Objective Minimum Qualifications)

  • Currently enrolled in a Bachelor’s degree in Mechanical Engineering, Thermal Engineering or an equivalent science/engineering field. Must be returning to the degree program after completion of the internship.
  • Reside in the United States and/or attend a university in the US.
  • Able to obtain work authorization in the US in 2026.
  • Have academic coursework, completed projects, prior internship and/or research experience or equivalent in at least three of the following areas:
    • Mechanical Engineering, Thermodynamics, Fluid Mechanics, Heat Transfer, Materials Science, Control System, Mechanical Design, Systems Engineering
  • Have proven experience (internships, projects, coursework) working on at least two of the following areas:
    • Industry Standard MCAD tools
    • Digital thermometers
    • Pressure Gauges
    • PCB Design
    • Computational Fluid Dynamics (CFD) Modeling
    • Electronic Packaging

Other

Preferred Qualifications:

  • Experience with CREO and Flow Therm
  • Minimum Cumulative GPA of 3.0 or higher

What We’ll Give You:

High‑impact projects:
You’ll get the opportunity to directly influence our cutting‑edge products. Got a question or idea? Voice it. Your curiosity could help advance our next‑generation cloud applications and help us find new ways to apply emerging technologies like AI, machine learning, and blockchain.

Mentors that care:
Work with industry‑leading professionals and award‑winning engineers. On top of your project supervisor, you’ll be assigned a peer mentor—a recent hire who can help you navigate the internship experience. You’ll also be paired with intern buddies to ensure 360‑degree support and engagement.

World‑class training:
Grow from once‑in‑a‑lifetime learning opportunities and…

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