Senior TSV Packaging Design Engineer; HBM & Simulation
Job in
Boise, Ada County, Idaho, 83708, USA
Listed on 2026-03-05
Listing for:
Micron Technology
Full Time
position Listed on 2026-03-05
Job specializations:
-
Engineering
Engineering Design & Technologists, Systems Engineer
Job Description & How to Apply Below
A leading semiconductor company in Boise, Idaho seeks an experienced Design Engineer for their TSV Packaging team. The role involves finite element analysis for advanced memory devices and requires 8+ years of experience in the semiconductor industry, along with expertise in engineering tools like ANSYS and Solid Works. Strong documentation skills and the ability to work collaboratively are essential. The company offers competitive benefits, including healthcare plans and paid time off.
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Position Requirements
10+ Years
work experience
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