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Wafer Probe Integration Engineer

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology, Inc.
Full Time position
Listed on 2026-03-01
Job specializations:
  • Engineering
    Electrical Engineering, Manufacturing Engineer, Process Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 100000 - 125000 USD Yearly USD 100000.00 125000.00 YEAR
Job Description & How to Apply Below

Overview

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Wafer Probe Integration Engineer at Micron Technology, Inc. within Test Solutions Engineering (TSE) Department Key Equipment Group (KEG); you will have responsibilities for developing, deploying, and supporting Wafer Probe Equipment and Processes used in our manufacturing global locations with an emphasis on HBM (High Bandwidth Memory). You will work with Test Engineering, Assembly Engineering, High Volume Manufacturing (HVM) Site teams and Suppliers to specify, design, develop, integrate and qualify solutions for HVM together with enabling Probe roadmap technologies.

A typical day in this position allows candidates to be creative and innovative in the deployment of first-of-a-kind solutions that tackle sophisticated problems.

Job Description:

As a Wafer Probe Integration Engineer at Micron Technology, Inc. within Test Solutions Engineering (TSE) Department Key Equipment Group (KEG); you will have responsibilities for developing, deploying, and supporting Wafer Probe Equipment and Processes used in our manufacturing global locations with an emphasis on HBM (High Bandwidth Memory). You will work with Test Engineering, Assembly Engineering, High Volume Manufacturing (HVM) Site teams and Suppliers to specify, design, develop, integrate and qualify solutions for HVM together with enabling Probe roadmap technologies.

A typical day in this position allows candidates to be creative and innovative in the deployment of first-of-a-kind solutions that solve sophisticated problems.

Responsibilities
  • Develop, deploy & support first and second-of-a-kind equipment and processes of Wafer Probers, Testers & Probe Cards

  • Engage equipment suppliers & vendors to address issues of quality, performance, and change management.

  • Establish metrics to drive continuous improvement of equipment performance and processes.

  • Perform statistical analysis of manufacturing data to ensure that processes meet the required quality standards.

  • Participate in Probe equipment solution definition and generate specification requirements that have capability requirements considered for qualification into Probe HVM site deployment.

  • Generate equipment specifications to meet safety and capability requirements of global manufacturing environments.

  • De-bug pre-production probe card issues through in-depth technical analysis identifying root cause and feedback implement corrective solutions to supplier and internal engineering groups.

  • Participate in Probe card design reviews with peers and technical teams.

  • Optimally prepare and present information to Engineering leadership teams.

  • Collaborate with global teams to establish and implement the best-known method probe processes globally.

  • Maintain a strong collaborative relationship with peer groups in other functional areas.

  • Initiate and chair meetings with global manufacturing sites in support of your objectives.

Qualifications
  • 5+ years of experience in mechanical and electrical engineering fundamentals.

  • Proficiency in statistics, data analysis, and design of experiments and project management

  • High degree of self-initiative with an ability to think independently.

  • Take initiative, ownership and drive for results across departments.

  • Track record of delivering accurate timely results.

  • The ability to manage multiple tasks concurrently and see them to a conclusion based on a given timeline.

  • Proficiency in thermal systems, machine design, electro-mechanical controls and components, electrical circuits, materials selection, and mechanical stress analysis.

  • Excellent verbal and written communication and presentation skills.

  • Ability to read and interpret electrical and mechanical build schematics.

  • Flexibility to accommodate off-shift meetings in other time zones.

Preferred Experience and Education
  • Solid understanding of semiconductor processes and semiconductor device test methodology

  • A Bachelor of Science degree in Electrical…

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