Process Engineer - Boise

Job Summary

SCREEN USA SPE Is seeking a skilled and customer-focused Wet Process Engineer to support our advanced clean and wet etch equipment installed at key customer manufacturing sites. This position plays a critical role in enabling HVM ramp, driving process sustaining, optimizing tool performance, and ensuring our wet process platforms deliver best in class results at customer fabs.

As the primary technical interface between our company and the customer, you will lead on-site process support, troubleshoot and process interactions, and collaborate with internal R&D and engineering teams to deliver continuous improvements. Salary Range: $100,000 - $175,000

Key Responsibilities:

• Provide on-site process expertise for our wet cleans, wet etch, and surface preparation tools.
• Partner closely with customer process owners to address recipe issues, process drifts, and tool-to-tool matching.
• Support new tool installs, conversions, and production ramp through recipe optimization and process validation.
• Translate customer technical needs into actionable feedback for internal engineering teams.

• Drive process stability and improvements as customers move from early ramp to high-volume manufacturing.
• Support customer qualification activities, including performance tests, defectivity checks, and acceptance milestones.
• Optimize recipes for throughput, defect performance, chemical usage, and yield impact to meet customer KPIs.

• Monitor process performance using SPC, signals, chamber health indicators, and customer data analytics.
• Lead root analysis for excursions, yield‑impacting events, and chemical/mechanical failures.
• Identify and implement improvements that enhance tool performance, reduce COO, and improve uptime.

• Work directly with internal hardware, software, chemistry, and applications teams to drive improvements.
• Provide detailed technical reports, updates, and presentations to both customer and internal stakeholders.
• Train customer engineers and technicians on best practices for tool operation and process handling.
• Accurate and effective communication is essential in this position. Japanese language skills are beneficial but not required.

This position will be primarily based in Boise,  will arise to travel to SCREEN Japan to support wafer demos and attend customer meetings. Some travel within the US to visit other customer sites (less than 20%). Just have a valid passport and REAL  immediate travel.

• Direct customer facing experience with semiconductor OEM or advanced fab operations.
• Excellent communication skills, with comfort in customer-facing technical discussions.
• Familiarity with wet process toolsets is a plus but not required.
• Experience supporting new tool installations, qualifications, or HVM transitions.
• Ability to manage multiple customer priorities in a fast-paced fab environment.
• Strong analytical skills with hands‑on experience using SPC, DOE, metrology tools, and failure analysis.
• Demonstrated ability to troubleshoot complex interactions between tool hardware, chemistry, fluid dynamics, and process conditions.

• Master’s Degree in Chemical Engineering, Materials Science, Chemistry, Mechanical Engineering, Electrical Engineering, or related field. OR
• Bachelor’s in same fields with 2+ years of semiconductor process engineering experience (wet etch, cleans, bevel etch, single‑wafer or batch tools preferred).