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Bonding Process Engineer – Advanced Packaging

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology
Full Time position
Listed on 2025-12-14
Job specializations:
  • Engineering
    Manufacturing Engineer, Quality Engineering
Job Description & How to Apply Below
Position: Staff Bonding Process Engineer – Advanced Packaging
A leading memory solutions company in Boise, Idaho, is seeking a Process Engineer for their APTD Bonding team. The role involves developing and optimizing processes to enhance product quality and reliability, alongside troubleshooting assembly issues. Candidates should have a BS degree with significant experience in semiconductor process engineering and strong analytical skills. This position offers a competitive salary and comprehensive benefits packages tailored to employee needs.
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