Sr. Engineer, Chemical Mechanical Polish

About our group:

At Seagate, our mission is to build the world's best data storage devices. The Advanced Transducer Development group is a global R&D organization dedicated to developing new recording head technologies to advance areal density and support Seagate's HDD (Hard Disk Drive) product roadmap for the next four years and beyond.

Our process team utilizes state-of-the-art wafer fabrication tools and cleanroom facilities to innovate and deliver leading-edge writers and read sensors. With a focus on proving the feasibility of new devices, processes, and materials, we drive Seagate's future time-to-market leadership.

If you are passionate about innovative technology development, naturally creative, and enthusiastic about bringing ideas to life, this could be the perfect opportunity to advance your research and development career.

• Support the development of novel, robust, and manufacturable Chemical Mechanical Polishing (CMP) processes to achieve critical planarity, roughness, and dimensional targets in nanometer-scale head devices.
• Contribute to maintaining the stability of wafer processes by performing data analysis for statistical process control and assisting in investigating root causes of process excursions.
• Assist in configuration, qualification, and scheduling of CMP equipment, and help coordinate R&D experimental runs.
• Work with design partners to understand device performance requirements and support efforts to align fabricated structures with design intent.
• Collaborate with the broader R&D and Product wafer teams (including lithography, deposition, etch, wet process, and integration) to help integrate new CMP process modules into advanced prototype wafer builds.
• Analyze and report on the impact of new CMP processes on downstream head performance.
• Work alongside wafer capital equipment suppliers to help define hardware paths that support advanced CMP capability and manufacturability.
• Support technology transfers to the product development engineering team.
• Contribute to Seagate's IP portfolio through participation in invention disclosures, patents, trade secrets, journal articles, and/or white papers.

• You are self-motivated, intellectually curious, and able to work independently with a strong attention to detail.
• You are an honest and respectful team player, capable of building strong partnerships with a diverse global group of engineers and technicians.
• You are a well-organized multitasker, skilled at balancing day-to-day wafer processing needs with longer-term development work.
• You maintain thorough documentation of results and can clearly present and discuss them with other team members in engineering and management forums.
• You have a track record of innovation and regularly leverage external sources (such as journals, patents, university projects, and conferences) to inspire new ideas and directions.
• You are interested in and capable of providing technical leadership to junior staff members.
• You are able and enthusiastic about working in a mix of clean room and laboratory environments.

• Bachelor's degree in Chemical Engineering, Materials Science, Mechanical Engineering, Chemistry, or a related science and engineering field with 5+ years of experience, or a Master's degree in the same fields with 3+ years of experience, or a Ph.D. with 0+ years of experience, or equivalent education and experience.
• Solid hands‑on experience and working knowledge of slurry chemistry, surface reactions, pad materials, mechanics of material removal, and other CMP‑related phenomena.
• Familiarity with thin film and nanostructure characterization techniques (e.g., AFM, ellipsometry, XRF, FIB, SEM, (S)
  TEM, etc.), with ability to perform or support measurements and analysis.
• Proficient in applying analytical techniques for slurry, nanoparticle, and pad characterization (e.g., PSD, HPLC, FTIR, nanoindentation, etc.) in support of process development or troubleshooting.
• Experience with operating and/or supporting maintenance of CMP process equipment in an R&D or production environment.

You might also have:

• Knowledge of modeling CMP mechanisms (including fluid flow,…