PCBA Manufacturing Engineer, Leo

Description

Amazon Leo is an initiative to increase global broadband access through a constellation of 3,236 satellites in low Earth orbit (LEO). Its mission is to bring fast, affordable broadband to unserved and underserved communities around the world, delivering high‑speed connectivity to consumers, businesses, government agencies, and other organizations operating in areas without reliable connections.

Export Control Requirement: candidates must be a U.S. citizen or national, a U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

• Work with the Design Engineering team to provide PCB/PCBA DFM feedback and identify and elevate manufacturing challenges early in product development.
• Drive the PCBA Manufacturing Qualification process at the CM, define manufacturing readiness requirements, and lead key milestone reviews to ensure production readiness.
• Investigate and develop new manufacturing technology and methodologies to improve PCBA quality, reliability, throughput, and cost.
• Drive closure of operational issues during pre‑production builds and work with Operations, Supply Chain, R&D, and Reliability Engineering to optimize processes and improve yields during production ramp.
• Investigate failures and defects in production, test, and integration, identify root causes, and implement preventive actions as part of continuous improvement.
• Identify opportunities for risk reduction and simplification of PCBA manufacturing processes.
• Deliver manufacturing process capabilities, including equipment capability, quality controls, materials characterization, and standardized rework practices.
• Actively monitor product and process success through production ramp, providing regular status reports from design to production.

• 4 years of experience in mechanical engineering or equivalent.
• 5 years of manufacturing, process, or industrial engineering experience.
• Experience with DFx (Design for cost, test, manufacturing).
• Experience working with fast‑moving, high‑performance teams and driving innovative solutions tailored to unique business environments.
• Experience in board assembly processes and equipment:
  Stencil, paste print, SPI, pick & place, SMT reflow, AOI, 5DX, selective solder, flying probe, and wash.
• Experience working independently and ensuring timely, accurate communication with contract manufacturers, suppliers, and third‑party test and failure analysis partners.

• 3 years of root cause analysis and process design experience.
• Knowledge of project and product quality tools such as Six Sigma or Lean operations.
• 1 year of designing experiments and conducting statistical analysis of results.
• Experience with IPC‑A‑610H Class 3, IPC J‑STD‑001H compliance.
• Experience in polymeric application, including conformal coating, staking, and underfill.
• Experience in solder alloys, including leaded, lead‑free, and next‑gen low‑temp alloys.
• Experience with flying probe test systems and DFT.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status. Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need an accommodation during the application and hiring process, including interview or onboarding support, please visit the disability accommodations page.

If the country/region you’re applying in isn’t listed, contact your Recruiting Partner.

The compensation for this position ranges from $105,600/year in our lowest geographic market up to $185,000/year in our highest. Pay varies by market location and is based on job‑related knowledge, skills, and experience. Amazon offers equity, sign‑on payments, and other benefits, in addition to medical, financial, and other programs. For more information, please visit.

This position will remain posted until filled. Applicants should apply via our internal or external career site.