Lead Thermal Packaging Architect; Multi-Physics
Job in
Austin, Travis County, Texas, 78716, USA
Listed on 2026-03-01
Listing for:
Advanced Micro Devices
Full Time
position Listed on 2026-03-01
Job specializations:
-
Engineering
Systems Engineer, Engineering Design & Technologists
Job Description & How to Apply Below
A leading technology company is seeking a candidate to lead the development of next-generation thermal technologies in Austin, Texas. You will guide architecture definition and design across various domains, requiring a strong background in thermal modeling and collaboration across engineering disciplines. The ideal candidate holds an MS or PhD in a relevant field and has experience with heat transfer and fluid dynamics.
This position demands leadership in thermal architecture within advanced packaging and data center applications.
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