DMTS SiPh Packaging & Assembly Materials

About Global Foundries:

• Global Foundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. Our Advanced Packaging and Photonics Center (APPC) is at the forefront of enabling next-generation optical interconnects and heterogeneous integration (HI) for AI, HPC, and data center applications. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets.
  
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• This DMTS-grade position will drive GF ’s industry lead ing Photonix platform growth into world class fully p ackaged electro - optical transceiver offerings utilizing 2.5D and 3D co-packaged optics form fact ors . The candidate will bring a s trong focus on product and module reliability, package risk factors, packaging design rules, materials selection criteria, definition of electrical, photonic, and thermal stress plan for chiplet and product module reliability qualification.
  
  Competency in definition of test and measurement methodology for modules capable of over 6.4
  
  Tbps data transfer is a requirement. Validated record of photonic and electrical interconnect innovation and product release/partnership with optical/electrical OSAT ecosystem is required .

• A successful candidate would possess industry leading product definition expertise for photonic and electronic packages, with primary focus on the compatibility of photonic interconnect and packaging solutions with present state-of-the-art electrical interconnect solutions . It is expected that options for optical fiber attach will include detachable fiber optic couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutions including Copper RX, Copper uPillar , chip-on-wafer hybrid bonding and wafer-to-wafer hybrid bonding .

• Hands on GF technical subject matter expert for SiPhotonics packaging responsible to answer internal and external questions and to build GF capability in this area through shared knowledge training and recruitment efforts
• Provides leadership and training of engineers in product packaging design reviews , materials selection and FMEAs of customer pa ckaging concepts
• Protects clients by ensuring that the maturity of a given technology, technology models, packaged design rules, and IP, meets industry expectations
• Ensures that all new technologies and features meet a standardized set of quality expectations tied to implementation into application representative package s for Data Centers, Automotive and Communications.
• Driving GF leadership in global SiPh advanced packaging product innovations, design enablement for customers , and efficient manufacturing processes internally and with OSAT ecosystems .
• Provides tools and complex analysis of quality issues and associated financial implications
• Protects the business by ensuring that all necessary requirements are met and that a technology performs to the expectations of a given customer or market to avoid costly re-designs
• Ensures standardization of site-based quality processes are executed appropriately
• Drives increased discipline and qualification robustness through a consistent global qualification process
• Perfom all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

• MS, or PhD + 20 or more years of experience

• Expertise in photonic and electronic package architecture definition

• Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.

• Experience in bringing packaged products from development…