Process Engineer; Bonding

Job Description

Insight Global is looking for a Process Engineer with a key focus in bonding to work on site in Austin, TX and support the strategy and introduction of products based on unique and highly differentiated capabilities of a preeminent foundry for semiconductor systems and defense electronics companies.

Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting-edge semiconductor manufacturing technology that will define future roadmaps of semiconductor devices including logic, memory, 3D packaged devices, including thermal management, etc.

• Running, developing and integrating semiconductor fabrication processes across a wide variety of semiconductor equipment.
• This would include running experiments, performing detailed process characterization, performing data analysis, documentation of processes of record, presentation of results, and incorporating feedback from engineers/techs.
• Developing processes-of-record and implementing these on product samples for customers.
• Assisting with documents such as proposals or reports on costs and inventory levels.

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances.

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• 3 + years of experience as a Process Engineer in the semiconductor industry
• Proficient with bonding tools
• Experience with TCB. pick-and-place, die-to-wafer bonding, or wafer-to-wafer bonding for ultra-small or small size die.
• Experience working in a fab/ cleanroom environment
• Bachelor's degree in materials science, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines. Experience with advanced packaging
• Masters degree