Post Doctoral Fellow - ECE
Listed on 2026-01-12
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Engineering
Electronics Engineer, Systems Engineer, Research Scientist, Electrical Engineering
Job Posting Title
Post Doctoral Fellow - ECE
Hiring DepartmentTexas Institute for Electronics
Position Open ToAll Applicants
Weekly Scheduled Hours40
FLSA StatusTo Be Determined at Offer
Earliest Start DateOngoing
Position DurationExpected to Continue
LocationAUSTIN, TX
Job DetailsGeneral Notes
About Us
The Texas Institute for Electronics (TIE) is a University of Texas at Austin-supported semiconductor consortium of state and local government, preeminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth.
Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing.
With over $1 billion in funding from the US DoD and the state of Texas, we’re at the forefront of creating cutting‑edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more. Situated in the heart of Austin - named "America's Coolest City" by Expedia and "The Best Place to Live in the U.S." by U.S. News and World Report - the Texas Institute for Electronics embodies the city's innovative spirit.
UT Austin, recognized by Forbes as one of America's Best Large Employers, provides outstanding employee benefits and total rewards packages that include:
- Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
- Voluntary Vision, Dental, Life, and Disability insurance options
- Generous paid vacation, sick time, and holidays
- Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
- Additional Voluntary Retirement Programs:
Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b) - Flexible spending account options for medical and childcare expenses
- Robust free training access through Linked In Learning plus professional conference opportunities
- Tuition assistance
- Expansive employee discount program including athletic tickets
- Free access to UT Austin's libraries and museums with staff
- Free rides on all UT Shuttle and Austin Cap Metro buses with staff
- For more details, please see:
Benefits | Human Resources and UT Austin Employee Experience | Human Resources
Must be authorized to work in the United States on a full‑time basis for any employer without sponsorship.
PurposeThe Postdoctoral Fellowship position at The University of Texas at Austin is to advance research in microelectronics, advanced packaging, and design enablement. Aiming to develop early‑career researchers by engaging them in both applied and fundamental research. Fellows will collaborate with a team of engineers and scientists on cutting‑edge advancements in heterogeneous integration.
Responsibilities- Conduct and lead applied and fundamental research in the areas of microelectronics, advanced packaging, and design enablement.
- Serve as part of a larger team of engineers and scientists working on cutting‑edge advancements in heterogeneous integration.
- Other related functions as assigned.
- A PhD received within the last 3 years in Electrical and/or Computer Engineering or a closely related discipline with a focus on integrated circuit design, packaging, and EDA (electronic design automation).
- Solid understanding of the IC physical design flow, familiarity with commercial EDA tools (e.g., Cadence, Synopsys/Ansys, Siemens).
- Willingness to work on cross‑stack optimizations and learn new skills.
- Experience with multi‑physics simulations for thermal, mechanical, and reliability analysis.
- Prior experience in EDA research and development.
- Prior chip tape‑out experience (digital/analog/RF ICs, etc.)
- Familiarity with applied ML, modeling, and optimization.
$70,000 + depending on…
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