Sr. Hardware Engineer - Interconnects, Annapurna Labs

Sr. Hardware Engineer - Interconnects, Annapurna Labs

Location:

Austin, TX (Remote options available)

Job : A3021761

We are seeking a senior Hardware Design Engineer to drive design, validation, and release of AWS next‑generation ML chips, cards, and server integration. Responsibilities include leading the design of server backplanes and cable interconnects, overseeing high‑speed connectors, and collaborating with cross‑functional teams to meet signal integrity, power integrity, and thermal requirements. The role also involves vendor management, manufacturing process oversight, and field issue resolution for interconnect systems.

• Lead the design, evaluation, and release of server backplane and cable interconnect solutions for high‑performance compute systems.
• Own end‑to‑end development of high‑speed connectors, including definition, selection, 3D modeling, simulation review, and mechanical integration.
• Collaborate with electrical, mechanical, and system architects to ensure interconnect designs meet signal integrity (SI), power integrity (PI), and thermal requirements.
• Manage relationships with connector and cable vendors: spec alignment, technical reviews, and performance validation.
• Apply signal integrity principles to optimize high‑speed links and reduce EMI/EMC challenges.
• Drive connector and cable manufacturing processes, including DFM, tooling, assembly techniques, and quality control.
• Support failure analysis, root cause investigations, and field issue resolutions related to interconnect systems.
• High‑speed PCB design experience is a plus.

• Experience in developing functional specifications, design verification plans, and functional test procedures.
• Bachelor’s degree in Electrical or Mechanical Engineering or related field.
• 6+ years of experience in connector or cable assembly design for high‑speed applications.
• Deep understanding of server backplane cable technologies including twinax, DAC, fiber, and hybrid solutions.
• Hands‑on experience with high‑speed connector technologies such as SFP, QSFP, MCIO, EDSFF, and OCP standards.
• Strong fundamentals in signal integrity: channel loss, crosstalk, impedance, and return loss.
• Proficiency in mechanical and electrical CAD tools such as Creo, Solid Works, and Allegro.
• Excellent written and verbal communication skills.

• Master’s degree in electrical engineering, computer engineering, or equivalent.
• Experience working with interdisciplinary teams to execute product design from concept to production.
• Experience with the project management of technical projects.
• Experience working with hyperscale compute, data center, or storage hardware.
• Knowledge of SI simulation tools such as Ansys HFSS and Keysight ADS is a plus.
• Familiarity with industry standards such as PCIe, SAS, SATA, IEEE, or OCP.
• Demonstrated success in vendor management and supplier development programs.
• Ability to work in a fast‑paced, ambiguous, and collaborative environment.

Amazon is an equal‑opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Job duties require safety, cooperation, and compliance with federal, state, and local laws. Applicants from Los Angeles County are considered under the Fair Chance Ordinance.

All applicable compensation varies by geographic market; base range is $128,600 to $213,600 per year, with additional equity, sign‑on, and benefits.