Product Engineer - II or Sr. Product Engineer, Texas Institute Electronics

Position: Product Engineer I - II or Sr. Product Engineer, Texas Institute for Electronics
* Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
* Voluntary Vision, Dental, Life, and Disability insurance options
* Generous paid vacation, sick time, and holidays
* Teachers Retirement System of Texas, a defined benefit retirement plan, with 7.75% employer matching funds
* Additional Voluntary Retirement Programs:
Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
* Flexible spending account options for medical and childcare expenses
* Robust free training access through Linked In Learning plus professional conference opportunities
* Tuition assistance
* Expansive employee discount program including athletic tickets.
* Free access to UT Austin's libraries and museums with staff
* Free rides on all UT Shuttle and Austin Cap Metro buses with staff
* Product and test vehicle validation to specifications, development and optimization of manufacturing/test workflows, 2.5D/3D modeling accuracies, creation of BKM’s (Best Known Practices) to comprehend and optimize Power/Thermal/Mechanical/Signal  Integrity/RF impacts of multi-chiplet and multi-domain heterogeneous micro-systems.  
* Contribute to the design and development of 2.5D & 3D advanced packaging solutions for semiconductor devices. Develop and support TIE's 3D-ADK (Assembly Design Kit).  
* Interpret fab metrology, defect, E-test yield, and evaluate silicon-to-simulation  correlation accuracies to understand and quantify process variations and their impacts on performance, yield, and reliability.  
* Drive corrective actions across cross-functional teams to fix and identify root-cause systematic yield and reliability issues. Perform Failure analysis on products manufactured at TIE  
* Collaborate with internal and external design teams to ensure package compatibility with semiconductor die and system-level requirements. Design and execute appropriate DOE’s  
* Stay current with industry trends and emerging technologies in semiconductor packaging and design integration to drive innovation and continuous improvement.  
* Define product DFT & DFM requirements and methodologies. Help with ATE Test plan definitions and requirements.  
* Bench/lab validation and characterization of various IC solutions and test structures to understand multi-physics impacts of our 3

DHI processes.  
* Leverage data analytics to drive product yield and reliability optimization.  
* Own entire product life cycle from bring up, performance/yield/reliability  optimization, to customer qualification.  
* Collaborate with customers to understand and resolve field failures.  
** Product Engineer I:
** Bachelor’s degree in Electrical Engineering, Semiconductor Physics, Computer Science, Materials Science or relevant field.  
** Product Engineer II:
** Bachelor’s degree in Electrical Engineering, Semiconductor Physics, Computer Science, Materials Science, and a minimum of three years of relevant industry experience.  
** Senior Product Engineer:
** Bachelor’s degree in Electrical Engineering, Semiconductor Physics, or Materials Science, and a minimum of ten years of relevant industry experience.
* * Strong understanding of semiconductor device physics and mixed signal IC behaviors.  
* Proficient programming skills in languages such as Python, MATLAB, C/C++, or Perl… for data analysis, and automation.  
* Strong communication and teamwork skills, with the ability to collaborate effectively with cross-functional teams.  
* Excellent analytical and problem-solving skills, as well as attention to detail.  
* Ability to thrive in a fast-paced environment and manage multiple projects simultaneously.  * (Eng II or Senior):
Prior experience in semiconductor design, product engineering, process Integration/manufacturing,  Test, or packaging required.  Experience or Interest in (for entry level) at least one of the following areas: IC/Micro-system Design, Product Validation, Test, Process or wafer fab Integration, Semiconductor Packaging manufacturing, Thermal/stress optimization, and/or quality assurance, ATE and/or Bench validation of IC’s or process test structures, Semiconductor Failure analysis. (SEM/CSAM experience…), Materials…