Senior or Principal Product Manager, Texas Institute Electronics

Position: Senior or Principal Product Manager, Texas Institute for Electronics
* Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
* Voluntary Vision, Dental, Life, and Disability insurance options
* Generous paid vacation, sick time, and holidays
* Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
* Additional Voluntary Retirement Programs:
Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
* Flexible spending account options for medical and childcare expenses
* Robust free training access through Linked In Learning plus professional conference opportunities
* Tuition assistance
* Expansive employee discount program including athletic tickets
* Free access to UT Austin's libraries and museums with staff
* Free rides on all UT Shuttle and Austin Cap Metro buses with staff
* For more details, please see  and   and
* ** Own the product strategy and roadmap
** for TIE’s advanced 2.5D/3D microsystems integration platforms, aligning engineering execution with market needs and business objectives. In this role (reporting into TIE’s Business Group), you will serve as the bridge between technical teams and customer requirements to drive product success.
* ** Author and maintain comprehensive Product Requirements Documents (PRDs)
** that guide TIE’s process development, EDA integration, and packaging engineering teams. You’ll ensure all stakeholders have a clear blueprint so development efforts remain aligned, efficient, and focused on the right priori

TIEs.
* ** Drive cross-functional collaboration
** across internal teams—including packaging R&D, process engineering, design automation, and product marketing—to ensure product features and releases are cohesive and aligned with overall strategy. You will be the key interface keeping everyone on the same page and moving toward common goals.
* ** Engage closely with customers and industry partners** (e.g. leading foundries and advanced packaging providers) to align our capabilities with evolving industry needs. You will represent TIE in technical discussions, gather customer feedback, and form strategic partnerships that enhance our microsystems platform and ecosystem presence.
* ** Serve as a technical champion for 2.5D/3D integration** – leverage your deep understanding of advanced packaging technologies to guide internal decision-making. You’ll act as a liaison in customer design reviews and industry forums, ensuring TIE’s solutions address real-world challenges in chiplet-based system design.
* ** Develop and execute detailed program plans
** covering scope, schedules, risk mitigation, resource allocation, and customer communication to drive predictable delivery of platform milestones. You will deliver results in fast-paced, multi-stakeholder engagements by managing dependencies and proactively resolving roadblocks.
* ** Create technical documentation and collateral** (such as integration guidelines, reference designs, and user guides) that support customer design teams and highlight the unique value of TIE’s technologies. You’ll ensure our technical content and training materials enable rapid adoption and success for our ecosystem users.
* ** Monitor advanced packaging market trends and competitive developments**, providing actionable insights to inform product positioning, feature prioritization, and differentiation. Your awareness of emerging standards and ecosystem shifts will help keep TIE at the forefront of the industry.
* ** Champion a culture of accountability and transparency across
** all product work streams. You make sure stakeholders are informed, expectations are managed, and commitments are met — fostering trust and a shared sense of mission among teams.
* Other related functions as assigned.
* *
* Education:

** BS in Electrical Engineering, Computer Engineering, or a related technical discipline.
* ** Industry

Experience:

**
* ** Senior Product Manager:
** 5+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends.
* ** Principal Product Manager:
** 10+ years of experience in…