Postdoctoral Fellow

Overview

Georgia Tech prides itself on its technological resources, collaborations, high-quality student body, and its commitment to building an outstanding and diverse community of learning, discovery, and creation. We strongly encourage applicants whose values align with our institutional values, as outlined in our Strategic Plan. These values include academic excellence, diversity of thought and experience, inquiry and innovation, collaboration and community, and ethical behavior and stewardship.

Georgia Tech has policies to promote a healthy work-life balance and is aware that attracting faculty may require meeting the needs of two careers.

Georgia Tech is a top-ranked public research university situated in the heart of Atlanta, a diverse and vibrant city with numerous economic and cultural strengths. The Institute serves more than 45,000 students through top-ranked undergraduate, graduate, and executive programs in engineering, computing, science, business, design, and liberal arts. Georgia Tech s faculty attracted more than $1.4 billion in research awards this past year in fields ranging from biomedical technology to artificial intelligence, energy, sustainability, semiconductors, neuroscience, and national security.

Georgia Tech ranks among the nation s top 20 universities for research and development spending and No. 1 among institutions without a medical school.

Mission and Values
Georgia Tech s mission is to develop leaders who advance technology and improve the human condition. The Institute has nine key values that are foundational to everything we do, including a commitment to safety, integrity, and service to the community.

Atlanta, GA

Georgia Tech is at the forefront of advancing semiconductor technologies, particularly in the areas of glass-core packaging and 3D heterogeneous integration. We are seeking highly motivated Post-Doctoral Fellows to contribute to groundbreaking research and collaborate with academic institutions, industry partners, and students in these exciting and rapidly evolving fields. We are seeking multiple researchers with expertise in two key areas of advanced packaging:

• Glass-Core Packaging
• 3D Heterogeneous Integration

These positions offer a unique opportunity to conduct cutting-edge research, work closely with graduate and undergraduate students, and collaborate with industry and academic partners. The position holders will contribute to advancing technologies that enable next-generation electronics while documenting their research progress and reporting to sponsors.

• Mentoring Students:
  Collaborate with and mentor graduate and undergraduate students in both research and development activities.
• Industry & Academic
  
  Collaboration:
  
  Work closely with academic institutions, industry partners, and external collaborators to ensure research is relevant and applicable to real-world applications.
• Research Documentation and Reporting:
  Maintain comprehensive records of research, including experimental data, design changes, and results. Provide clear, concise reports to sponsors and stakeholders according to timelines.
• Sponsor Reporting:
  Provide timely and thorough updates to project sponsors, including presentations to sponsors and the technical community.
• Cross-Disciplinary Teamwork:
  Collaborate with other researchers, engineers, and external partners to drive innovation.
• Scholarly Publications:
  Advance foundational science and publish scholarly articles.

• Develop and implement new techniques for microstructuring glass cores for advanced packaging applications.

• Design, fabricate, and characterize high-density interconnects for glass-core packaging.

• Develop physics-based thermo-mechanical models, conduct experiments using physical samples and prototypes, enhance fabrication processes, and predict failures.

• Develop multi-scale and multi-physics numerical models for various packaging materials; analyze interlayer delamination, cracking, and warpage under monotonic and fatigue loading.

• Characterize materials, interfaces, and samples for thermo-mechanical properties; determine defects; conduct reliability experiments and failure analyses.

• Compound Semiconductor and Si Stacking, Fabrication, and Mechanical Characterization:
  Design and fabricate TSVs for 3D integration and validate performance.
• Thermo-Mechanical Modeling and Experimental Validation
• Computational Mechanics
• Characterization and Reliability Assessment
• Advanced Bonding and Assembly Technologies for 3D Chip Stacks:
  Develop and apply bonding and assembly methods to enhance performance and reliability.

• A doctoral degree in Engineering or related fields.