Senior Principal Electro-Mechanical Engineer

Senior Principal Electro-Mechanical Engineer

Date Posted:

Country:
United States of America

Location:

MA112:
Andover MA 358 Lowell St Dukes 358 Lowell Street Dukes, Andover, MA, 01810 USA

Position Role Type:
Onsite

U.S. Citizen Requirement:
Must obtain and maintain a U.S. government‑issued security clearance. U.S. citizenship required.

Security Clearance:
DoD Clearance:
Secret

About Raytheon:
At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring more than 100 years of experience and engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world.

The RF Microelectronics/Module Design & Foundry Services Department at Raytheon in Andover, MA, is currently seeking a Sr. Principal Electro-Mechanical Engineer to develop leading‑edge miniaturized 3

DHI sensors and systems to enable future generation technologies across Raytheon. The successful candidate will be a highly motivated self‑starter who applies strong mechanical and electrical engineering skills to implement innovative solutions to challenging design criteria. They will be involved in research efforts including initial concepts, advanced technology demonstrations, and will have the opportunity to follow product development from beginning to end, including documentation, fabrication, assembly, and test/delivery of a range of microelectronics products.

This position requires strong interpersonal, written, and verbal communication skills to maintain positive relationships and satisfaction with Program leadership (Engineering and Program Management). Knowledge of semiconductor manufacturing processes and materials and prior experience working with contract manufacturers (OSATs) is highly desired.

The role requires knowledge of high‑density microelectronic packaging designs including interposers, organic substrates, wafer and chip bumping and general knowledge in areas of electronic components/devices such as ASICs and FPGAs, design of electronic packaging chassis and structures, interconnects (connectors/cables), and thermal management design of high‑density electronic systems and electronic enclosures. The successful candidate will bring new ideas to the team, with opportunities to explore research and innovation areas in a collaborative and fun team environment.

Additionally, the candidate is expected to follow established procedures in creation of technical data package work products, while working closely with program management and functional supervision to ensure design objectives are met.

• Work with cross‑functional hardware engineering teams to develop advanced microelectronics packages including 3
  
  DHI, 3D, and 2.5D (interposer + chiplets) and novel material and process solutions for RF, digital, mixed‑signal, and photonics products.
• Leverage industry‑leading manufacturing and novel materials to achieve new levels of electro‑mechanical performance and reliability.

• Typically requires a Bachelor’s Degree in a STEM field and a minimum of ten (10) or more years of relevant experience. An advanced STEM degree could count for 3 years of experience, with mechanical and electrical engineering design.
• Experience performing circuit layout design using 2D CAD tools.
• The ability to obtain and maintain a U.S. security clearance. U.S. citizenship required.

• Master’s degree or Ph.D. in a STEM field.
• Experience in RF circuit design, including 3D EM simulation in HFSS or similar tools.
• Circuit layout design experience using 2D and 3D CAD tools (Cadence Virtuoso and/or Allegro/APD+).
• Experience and familiarity with selection and oversight for semiconductor wafer processing and finishing (plating, bumping, dicing).
• Design experience with 3D and 2.5D packaging, complex CAD/EDA software design workflows, and RF/thermal/digital co‑design.
• Experience qualifying and implementing cutting‑edge materials, fabrication techniques, and understanding of relevant materials used…