Semiconductor Development Engineer

Reports to: VP of Engineering

Job : 202503

Travel Required: Limited

Position Type: Full Time, Individual Contributor

City: Andover

State: MA

Country: US

EPC Space is a leader in the design and manufacture of high-reliability, radiation-hardened (Rad Hard) Gallium Nitride (GaN) power management solutions. Our products are engineered for the most demanding environments on (and off) the planet, supporting critical missions in satellite communications, LEO/GEO orbits, and deep space exploration. We combine world-class GaN technology with aerospace heritage to push the boundaries of power density and efficiency.

We are seeking an experienced Semiconductor Package Development Engineer to lead the design, simulation, and qualification of next-generation power packages. As an individual contributor, you will own the packaging roadmap for our high-reliability GaN FETs and ICs. You will be responsible for ensuring our products meet stringent space-grade standards (MIL-PRF-19500 and MIL-PRF-38535) while optimizing for thermal performance and extreme environmental survivability.

• Package Design & Development: Lead the end-to-end development of advanced hermetic and plastic packages, including ceramic substrates, lead frames, and chip‑scale packaging (CSP) for Rad‑Hard applications.
• Thermal & Mechanical Analysis: Conduct high‑fidelity thermal simulations and structural analysis to ensure junction temperatures are managed and mechanical stresses are minimized under launch and orbital conditions.
• High‑Reliability
  
  Qualification:
  
  Define and execute package-level qualification plans.
• Failure Analysis: Lead root‑cause analysis for packaging-related failures during development and qualification, utilizing tools such as CSAM, X‑ray, and SEM.
• New Product Introduction (NPI): Transition designs from concept to high-volume manufacturing, ensuring robust yields and repeatable assembly processes.

• Education: Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
• Experience: Minimum of 5 years of hands‑on experience in semiconductor package development and thermal management.
• Technical
  
  Skills:
  
  Proficiency in thermal simulation tools (e.g.,
  Ansys Icepak, Flotherm, or MSC Nastran
  ).
• Strong understanding of package-level materials (CTE matching, thermal interface materials, hermetic sealing).
• Experience with power semiconductor packaging (GaN or SiC experience is a significant plus).
• Knowledge of advanced 2.5D/3D packaging or heterogeneous integration.
• Industry Knowledge: Familiarity with high-reliability standards and the unique challenges of the space environment (out gassing, radiation effects, thermal cycling).
• Communication: Ability to work independently in a fast-paced environment and communicate complex technical trade-offs to cross-functional teams.

At EPC Space, you will be at the forefront of the “New Space” revolution. We offer the agility of a high-tech startup backed by the stability of industry giants. You will see your designs fly on the world’s most advanced spacecraft and contribute to the future of space exploration.

To apply to the position, send resume to talentce. Place the job opening number in the subject line of the email. Provide resume in PDF format and use full name in file name.