Integration Engineer

Psi Quantum'smission is to build the first useful quantum computers-machines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016, our singular focus has been to build and deploy million-qubit, fault-tolerant quantum systems.

Quantum computers harness the laws of quantum mechanics to solve problems that even the most advanced supercomputers or AI systems will never reach. Their impact will span energy, pharmaceuticals, finance, agriculture, transportation, materials, and other foundational industries.

Our architecture and approachisbased on silicon photonics. Byleveragingthe advanced semiconductor manufacturing industry-including partners like Global Foundries-we use the same high-volume processes that already produce billions of chips for telecom and consumer electronics. Photonics offers natural advantages for scale: photons don'tfeel heat, are immune to electromagnetic interference, and integrate with existing cryogenic cooling and standard fiber-optic infrastructure.

In 2024,Psi Quantum announced government-funded projects to support the build-out of our first utility-scale quantum computers in Brisbane, Australia, and Chicago, Illinois. These initiatives reflect a growing recognition that quantum computing will be strategically and economically defining-and that now is the time to scale.

Psi Quantum also develops the algorithms and software needed to make these systems commercially valuable. Our application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact.

Quantum computing is not an extension of classical computing. Itrepresentsa fundamental shift-and a path to mastering challenges that cannot besolvedany other way. The potential is enormous, and we have a clearpathto make it real.

Come join us.

Job Summary:

Psi Quantum is building the world's first commercially viable quantum computer powered by silicon photonics. Our Foundry Engineering team partners with leading semiconductor manufacturers to co-develop advanced silicon-based photonic platforms that enable scalable quantum systems.

In this role, you will lead the development and integration of optical interposer and advanced packaging technologies that form the foundation of Psi Quantum's photonic quantum architecture. This work spans wafer-level processing, heterogeneous integration, packaging co-design, and materials development to deliver high-yield, high-performance optical interfaces connecting photonic and electronic subsystems.

The ideal candidate will have deep experience in optical interposer process integration, including photonic waveguide integration, optical I/O coupling, and wafer-level packaging. You will collaborate closely with Psi Quantum's design, packaging, and foundry partners to bring next-generation optical interconnect technologies from concept to production readiness.

Responsibilities:

• Lead the process development and integration of optical interposer modules, including photonic waveguide layers, and precision optical coupling structures.
• Develop and qualify wafer-level processes for photonic and optoelectronic integration, including alignment, bonding, and encapsulation for optical performance and reliability.
• Define design rules, process assumptions, and wafer acceptance criteria for optical interposer and packaging modules.
• Drive co-design across photonic, electrical, and mechanical domains to optimize performance, manufacturability, and yield.
• Partner with foundry and packaging vendors to develop optical I/O solutions, such as fiber attach, and photonic-electronic co-packaging.
• Analyze inline metrology, optical loss measurements, and defect data to identify and resolve yield limiters.
• Establish process controls, statistical methods (Cp/Cpk), and reliability test protocols for new optical and packaging modules.
• Collaborate with multi-disciplinary teams to support materials selection, tool evaluation, and computational modeling for next-generation optical integration schemes.

Experience/Qualifications:

• M.S. or Ph.D. in Electrical Engineering, Materials Science, Applied Physics, or a related field.
• 10+ years of experience in semiconductor or photonic process integration, optical packaging, or heterogeneous photonic integration.
• Proven experience inoptical interposer development, including silicon photonics, glass/silicon interposer platforms, or wafer-level photonic packaging.
• Familiarity withoptical coupling techniques (fiber attach, grating couplers, lens alignment) and low-loss photonic integration processes.
• Demonstrated ability to managecross-functional development programs with external foundry and OSAT partners.
• Experience withinline optical metrology, wafer-level testing, yield improvement, and defect reduction.
• Understanding ofadvanced packaging technologies, including hybrid bonding, chiplet integration, or co-packaged optics, is…