Senior Plasma Etch process development engineer

Introduction

At IBM Research, we are the innovation engine of IBM. Exploring what’s next in computing and shaping the technologies the world will rely on tomorrow. From advancing AI and hybrid cloud to pioneering practical quantum computing, we anticipate challenges and unlock new opportunities for clients, partners, and society. Working in Research means joining a team that accelerates discovery at the intersection of high‑performance computing, AI, quantum, and cloud.

You’ll collaborate with leading scientists, engineers, and visionaries to push boundaries and turn ideas into reality. With a culture built on curiosity, creativity, and collaboration, IBM Research offers the opportunity to grow your career while contributing to breakthroughs that transform industries and change the world.

IBM Research at Albany, NY is seeking experienced engineer who will push boundaries in the development of cutting‑edge patterning methodologies and plasma etch processes for next generation semiconductor technologies. In this role, you will be responsible for defining patterning strategies from initial concept of film stacks and process flow through the development of plasma etch processes and its maturing as process of record to meet advanced logic ground rule targets.

The hired candidate would be a demonstrated technical and industry leader in semiconductor plasma etch with fundamental and deep understanding of plasma physics, etch chemistries, plasma diagnostics, and plasma etch equipment system. The candidate will be a hands‑on engineering leader with significant expertise in FEOL/MOL/BEOL patterning processes such as multi‑patterning etch, conductor/dielectric etch, high‑aspect‑ratio etch. The candidate should also demonstrate strong understanding of industry trends and roadmap in the semiconductor industry.

The position also involves mentoring junior engineers and close collaboration with multi‑company and cross‑function engineers from materials, process, metrology, characterization, equipment, integration, layout design, and modeling. Generation of intellectual property for IBM and protection of it through the patenting process are also expected. Strong analytical and design‑of‑experiment experience, and excellent written and verbal communication skills in English are required.

• Doctorate Degree

• Master’s degree in a science or engineering discipline
• 8+ years hands‑on industry experience in plasma etch process, plasma etch diagnostics or plasma etch equipment development
• 8+ hands‑on experience in a semiconductor research and development environment
• 8+ years hands‑on experience with interpreting failure analysis from structural and chemical characterization techniques
• Design of experiments, process controls, and statistical data analysis

• PhD degree in a science or engineering discipline
• 10+ years hands‑on industry experience in plasma etch process, plasma etch diagnostics or plasma etch equipment development
• 10+ years hands‑on industry experience in FEOL/MOL/BEOL etch process development